SCHEMBL368400

SCHEMBL368400

O=C(CCNC(=O)c1cc(C(=O)NCCC(=O)NO)cc(C(=O)NCCC(=O)NO)c1)NO

nearest known ligand 0.53

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 18/20 0.53
HDAC3 O15379 16/20 0.53
HDAC2 Q92769 16/20 0.53
HDAC4 P56524 14/20 0.53
HDAC7 Q8WUI4 14/20 0.53
HDAC10 Q969S8 14/20 0.53
HDAC11 Q96DB2 14/20 0.53
HDAC8 Q9BY41 14/20 0.53
HDAC6 Q9UBN7 14/20 0.53
HDAC9 Q9UKV0 14/20 0.53
HDAC5 Q9UQL6 14/20 0.53
LTA4H P09960 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3054699 0.91 HDAC1 (0.48) HDAC1HDAC3HDAC2HDAC4HDAC7
SCHEMBL13376962 0.84 HDAC1 (0.45) HDAC1HDAC3HDAC2HDAC4HDAC7
SCHEMBL6385721 0.82 HDAC6 (0.76) HDAC1HDAC3HDAC2HDAC4HDAC7
SCHEMBL11116592 0.80 HDAC1 (0.77) HDAC1HDAC3HDAC2HDAC4HDAC7
SCHEMBL7808014 0.80 NTRK2 (0.50) HDAC1HDAC3HDAC2HDAC4HDAC7
SCHEMBL394245 0.78 FABP4 (0.59)
SCHEMBL11118792 0.78 HDAC6 (0.54) HDAC1HDAC3HDAC2HDAC4HDAC7
Hydrochloric Acid SCHEMBL10771309 0.77 HDAC6 (0.52) HDAC1HDAC3HDAC2HDAC4HDAC7
SCHEMBL6389404 0.77 HDAC6 (0.78) HDAC1HDAC3HDAC2HDAC4HDAC7
SCHEMBL6387379 0.76 HDAC1 (0.71) HDAC1HDAC3HDAC2HDAC4HDAC7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150307818-A1 AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES ADVANCED TECH MATERIALS (US) 2015-10-29 US claimed
EP-0665582-B1 Surface treating agents and treating process for semiconductors WAKO PURE CHEM IND LTD (JP) 2001-03-14 EP claimed
US-5580846-A USING A COMPLEXING AGENT; REMOVAL OF ALUMINUM FROM SURFACES WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-12-03 US claimed
EP-0665582-A2 Surface treating agents and treating process for semiconductors WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1995-08-02 EP claimed
US-20150307818-A1 AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES ADVANCED TECH MATERIALS (US) 2015-10-29 US disclosed
US-9063431-B2 Aqueous cleaner for the removal of post-etch residues ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2015-06-23 US disclosed
EP-2593964-A2 AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES Advanced Technology Materials, Inc. (US) 2013-05-22 EP disclosed
WO-2012009639-A9 AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2012-05-24 WO disclosed
WO-2012009639-A2 AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2012-01-19 WO disclosed
WO-2010091045-A2 NON-FLUORIDE CONTAINING COMPOSITION FOR THE REMOVAL OF POLYMERS AND OTHER ORGANIC MATERIAL FROM A SURFACE ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2010-08-12 WO disclosed
WO-2009032460-A1 NON-FLUORIDE CONTAINING COMPOSITION FOR THE REMOVAL OF RESIDUE FROM A MICROELECTRONIC DEVICE ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2009-03-12 WO disclosed
EP-0665582-B1 Surface treating agents and treating process for semiconductors WAKO PURE CHEM IND LTD (JP) 2001-03-14 EP disclosed
US-5580846-A USING A COMPLEXING AGENT; REMOVAL OF ALUMINUM FROM SURFACES WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-12-03 US disclosed
EP-0665582-A2 Surface treating agents and treating process for semiconductors WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1995-08-02 EP disclosed