SCHEMBL3684416

SCHEMBL3684416

C=C(C)C(=O)OCCCOP(=O)(OC)OC

nearest known ligand 0.51

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.51
THRB P10828 1/20 0.44
POLB P06746 1/20 0.40
APEX1 P27695 1/20 0.40
HTT P42858 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
ALDH1A1 P00352 3/20 0.39
CYP3A4 P08684 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27838291 0.97 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL27985384 0.95 TSHR (0.59) TSHRTHRBPOLBAPEX1HTT
SCHEMBL40925 0.91 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL3680829 0.89 THRB (0.52) TSHRTHRBPOLBAPEX1HTT
SCHEMBL40719 0.87 TSHR (0.61) TSHRTHRBPOLBAPEX1HTT
SCHEMBL3195852 0.86 TSHR (0.65) TSHRTHRBPOLBAPEX1HTT
SCHEMBL5958668 0.86 TSHR (0.65) TSHRTHRBPOLBAPEX1HTT
SCHEMBL5958661 0.86 TSHR (0.65) TSHRTHRBPOLBAPEX1HTT
SCHEMBL5958681 0.86 TSHR (0.65) TSHRTHRBPOLBAPEX1HTT
SCHEMBL180279 0.86 TSHR (0.65) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7851534-B2 Use between a radiating body such as a heat sink and a heat-generating part for electronics or parts such as integrated circuits; binder component, a maleated liquid polyolefin, and thermally conductive filler(s) selected from metal oxides and metal hydroxides; good flexibility, no offensive odor 3M INNOVATIVE PROPERTIES COMPANY (US) 2010-12-14 US disclosed
EP-1791874-B1 THERMALLY CONDUCTIVE SHEET 3M INNOVATIVE PROPERTIES CO (US) 2009-03-11 EP disclosed
US-20070249755-A1 Thermally Conductive Composition 3M INNOVATIVE PROPERTIES COMPANY (PA) 2007-10-25 US disclosed
US-20070224426-A1 Use between a radiating body such as a heat sink and a heat-generating part for electronics or parts such as integrated circuits; binder component, a maleated liquid polyolefin, and thermally conductive filler(s) selected from metal oxides and metal hydroxides; good flexibility, no offensive odor 3M INNOVATIVE PROPERTIES COMPANY 2007-09-27 US disclosed
EP-1791874-A1 THERMALLY CONDUCTIVE SHEET 3M Innovative Properties Company (US) 2007-06-06 EP disclosed
EP-1773925-A1 THERMALLY CONDUCTIVE COMPOSITION 3M Innovative Properties Company (US) 2007-04-18 EP disclosed
WO-2006019751-A1 THERMALLY CONDUCTIVE COMPOSITION 3M INNOVATIVE PROPERTIES COMPANY (US) 2006-02-23 WO disclosed
WO-2006016936-A1 THERMALLY CONDUCTIVE SHEET 3M INNOVATIVE PROPERTIES COMPANY (US) 2006-02-16 WO disclosed