Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.36 |
| ▸ | TP53 | P04637 | 4/20 | 0.35 |
| ▸ | LMNA | P02545 | 4/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.33 |
| ▸ | MEN1 | O00255 | 2/20 | 0.33 |
| ▸ | PKM | P14618 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL169015 | 0.92 | PKM (0.39) | SMN1; SMN2TP53LMNAALDH1A1KMT2A | |
| SCHEMBL4839427 | 0.90 | TP53 (0.36) | SMN1; SMN2TP53LMNAALDH1A1TSHR | |
| SCHEMBL166977 | 0.90 | TP53 (0.40) | SMN1; SMN2TP53LMNAALDH1A1TSHR | |
| SCHEMBL19350443 | 0.87 | PKM (0.46) | SMN1; SMN2TP53LMNAALDH1A1KMT2A | |
| SCHEMBL19203369 | 0.86 | TP53 (0.35) | SMN1; SMN2TP53LMNAALDH1A1KMT2A | |
| SCHEMBL20017398 | 0.85 | TP53 (0.37) | SMN1; SMN2TP53LMNAALDH1A1TSHR | |
| SCHEMBL13456054 | 0.84 | PKM (0.38) | SMN1; SMN2TP53ALDH1A1PKM | |
| SCHEMBL30224949 | 0.84 | ALDH1A1 (0.36) | SMN1; SMN2TP53LMNAALDH1A1KMT2A | |
| SCHEMBL536194 | 0.84 | SMN1; SMN2 (0.39) | SMN1; SMN2TP53LMNAALDH1A1KMT2A | |
| SCHEMBL12938734 | 0.83 | PKM (0.34) | SMN1; SMN2TP53LMNAALDH1A1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6905795-B2 | Mixture of lithium compound and organonitrogen polymer in aprotic solvent | SAMSUNG SDI CO., LTD. (KR) | 2005-06-14 | — | — | US | claimed |
| US-20030087159-A1 | Mixture of lithium compound and organonitrogen polymer in aprotic solvent | SAMSUNG SDI CO., LTD. (KR) | 2003-05-08 | — | — | US | claimed |
| US-10131824-B2 | Adhesive composition, adhesive sheet, and method for producing semiconductor device | LINTEC CORPORATION (JP) | 2018-11-20 | — | — | US | disclosed |
| US-9434865-B2 | Adhesive composition, an adhesive sheet and a production method of a semiconductor device | LINTEC CORPORATION (JP) | 2016-09-06 | — | — | US | disclosed |
| US-9382455-B2 | Adhesive composition, an adhesive sheet and a production method of a semiconductor device | LINTEC CORPORATION (JP) | 2016-07-05 | — | — | US | disclosed |
| US-20160160094-A1 | Adhesive Composition, Adhesive Sheet, and Method for Producing Semiconductor Device | LINTEC CORPORATION (JP) | 2016-06-09 | — | — | US | disclosed |
| US-20130244401-A1 | Adhesive Composition, An Adhesive Sheet and a Production Method of a Semiconductor Device | LINTEC CORPORATION (JP) | 2013-09-19 | — | — | US | disclosed |
| US-20130244402-A1 | Adhesive Composition, An Adhesive Sheet and a Production Method of a Semiconductor Device | LINTEC CORPORATION (JP) | 2013-09-19 | — | — | US | disclosed |
| US-20120148837-A1 | ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR INSPECTING STAMPERS | LINTEC CORPORATION (JP) | 2012-06-14 | — | — | US | disclosed |
| EP-2452992-A1 | ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET FOR INSPECTING STAMPERS | LINTEC Corporation (JP) | 2012-05-16 | — | — | EP | disclosed |
| WO-2007117952-A1 | PRESSURE-SENSITIVE ADHESIVE FILM AND METHOD FOR MAINTAINING FLOOR SURFACES | JOHNSONDIVERSEY, INC. (US) | 2007-10-18 | — | — | WO | disclosed |
| EP-0530729-A1 | Method for grinding back side of semiconductor wafer and pressure-sensitive adhesive tape used in said method | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-03-10 | — | — | EP | disclosed |