Sulfuric Acid

Sulfuric Acid

SCHEMBL3698698

CCCC[PH](CCCC)(CCCC)CCCC.O=S(=O)(O)O

nearest known ligand 0.43

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TP53 P04637 2/20 0.43
CA1 P00915 3/20 0.37
CA2 P00918 3/20 0.37
ALDH1A1 P00352 2/20 0.36
CA12 O43570 1/20 0.35
CA7 P43166 1/20 0.35
CA14 Q9ULX7 1/20 0.35
PPARA Q07869 2/20 0.34
FAAH O00519 5/20 0.33
CES2 O00748 3/20 0.33
CES1 P23141 2/20 0.33
CA5A P35218 1/20 0.33
CA5B Q9Y2D0 1/20 0.33
TSHR P16473 1/20 0.33
MEN1 O00255 1/20 0.32
HTT P42858 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL7637283 0.97 TP53 (0.41) TP53CA1CA2ALDH1A1CA12
Sulfuric Acid SCHEMBL7635917 0.93 TP53 (0.39) TP53CA1CA2ALDH1A1CA12
Sulfuric Acid SCHEMBL10530617 0.93 TP53 (0.43) TP53CA1CA2ALDH1A1PPARA
SCHEMBL22609074 0.92 CA2 (0.40) TP53CA1CA2ALDH1A1CA12
Sulfuric Acid SCHEMBL20975191 0.91 ALDH1A1 (0.43) TP53CA1CA2ALDH1A1CA12
Sulfuric Acid SCHEMBL17102623 0.90 TP53 (0.40) TP53CA1CA2ALDH1A1CA12
Bromide SCHEMBL29102634 0.90 CA2 (0.39) TP53CA1CA2ALDH1A1CA12
SCHEMBL13043123 0.85 APP (0.41) TP53CA1CA2ALDH1A1PPARA
SCHEMBL27468628 0.85 APP (0.41) TP53CA1CA2ALDH1A1PPARA
Trifluoromethanesulfonic Acid SCHEMBL28416043 0.84 EPHX1 (0.42) FAAHCES2CES1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2998968-A1 COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD Ishihara Chemical Co., Ltd. (JP) 2016-03-23 EP claimed
US-20160029483-A1 COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD ISHIHARA CHEMICAL CO., LTD. (JP) 2016-01-28 US claimed
CN-119968229-A Filter with electrostatic filtering function 马蒂夫卢森堡公司 2025-05-09 CN disclosed
US-12205775-B2 Process to improve coverage and electrical performance of solid electrolytic capacitors KEMET ELECTRONICS CORPORATION (US) 2025-01-21 US disclosed
WO-2023238500-A1 TREATMENT AGENT FOR CARBON FIBER PRECURSOR, AND CARBON FIBER PRECURSOR 竹本油脂株式会社 2023-12-14 WO disclosed
WO-2022221058-A1 A PROCESS TO IMPROVE COVERAGE AND ELECTRICAL PERFORMANCE OF SOLID ELECTROLYTIC CAPACITORS KEMET ELECTRONIC CORPORATION (US) 2022-10-20 WO disclosed
US-20220223351-A1 Process to Improve Coverage and Electrical Performance of Solid Electrolytic Capacitors KEMET ELECTRONICS CORPORATION 2022-07-14 US disclosed
US-20170150725-A9 HETEROPOLYOXOMETALATES POM PATENTVERWALTUNGS GBR (DE) 2017-06-01 US disclosed
EP-2953956-B1 HETEROPOLYOXOMETALATES POM PATENTVERWALTUNGS GBR (DE) 2016-12-28 EP disclosed
EP-2998968-A1 COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD Ishihara Chemical Co., Ltd. (JP) 2016-03-23 EP disclosed
US-20160029483-A1 COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD ISHIHARA CHEMICAL CO., LTD. (JP) 2016-01-28 US disclosed
EP-1457838-A1 Method to reduce precipitation in developers for lithographic printing plates Fuji Photo Film B.V. (NL) 2004-09-15 EP disclosed
EP-1455234-A1 Method to reduce precipitation in developers for lithographic printing plates Fuji Photo Film B.V. (NL) 2004-09-08 EP disclosed
US-5837425-A PRESENSITIZATION OF PLATES, SUPPORTS, MULTILAYER, EXPOSURE TO ACTINIC RADIATION OF FILMS, DEVELOPMENT OF PLATES WITH ALKALI FUJI PHOTO FILM CO., LTD. (JP) 1998-11-17 US disclosed
US-5580704-A CONTAINING BASIC DYE, ORGANIC SOLVENT HAVING LOW WATER SOLUBILITY, HYDROTROPE AGENT, ANIONIC SURFACTANT; HIGH DYE DENSITY, LOW FOAMABILITY, NONPRECIPITATING, NONSTAINING FUJI PHOTO FILM CO., LTD. (JP) 1996-12-03 US disclosed
EP-0716347-A1 Developer for photosensitive lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 1996-06-12 EP disclosed
EP-0516372-B1 Concentrated dampening water composition for lithographic printing FUJI PHOTO FILM CO LTD (JP) 1996-04-24 EP disclosed
EP-0652489-A1 Process for processing a photosensitive lithographic printing plate requiring no fountain solution FUJI PHOTO FILM CO., LTD. (JP) 1995-05-10 EP disclosed
US-5221330-A Hydrophilic film-forming polymer, buffer, water miscible organic solvent, micelle-forming compound, water FUJI PHOTO FILM CO., LTD. (JP) 1993-06-22 US disclosed
EP-0516372-A1 Concentrated dampening water composition for lithographic printing FUJI PHOTO FILM CO., LTD. (JP) 1992-12-02 EP disclosed