SCHEMBL3720969

SCHEMBL3720969

COCN1CCNC1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14933230 0.88 SMN1; SMN2 (0.49)
SCHEMBL722916 0.79 KMT2A (0.41)
SCHEMBL612958 0.79 ADORA2A (0.45)
SCHEMBL724135 0.76 KMT2A (0.39)
SCHEMBL16061716 0.76 KMT2A (0.42)
SCHEMBL27950274 0.75 KMT2A (0.38)
SCHEMBL301524 0.75
SCHEMBL13236669 0.74 ALDH1A1 (0.50)
SCHEMBL4037683 0.74 ALDH1A1 (0.50)
SCHEMBL1386657 0.74 ACHE (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250228865-A1 COMPOUNDS FOR ENHANCING READ THROUGH OF GENES CONTAINING PREMATURE TERMINATION CODONS AND METHODS FOR MAKING AND USING THE SAME SANOFI US SERVICES INC. (US) 2025-07-17 US disclosed
CN-117866195-A High refractive index material 罗门哈斯电子材料有限责任公司 2024-04-12 CN disclosed
CN-116783250-A Condensation-curable silicone composition, cured product, and method for producing the cured product 信越化学工业株式会社 2023-09-19 CN disclosed
CN-109725490-B Photosensitive resin composition, dry film, cured product, semiconductor element, printed circuit board and electronic component 太阳控股株式会社 2023-06-06 CN disclosed
CN-115685679-A Curable resin composition, pattern, and image display device 东友精细化工有限公司 2023-02-03 CN disclosed
CN-114316137-A High refractive index materials 罗门哈斯电子材料有限责任公司 2022-04-12 CN disclosed
EP-2781504-A1 CYCLIC COMPOUND, METHOD FOR PRODUCING SAME, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN Mitsubishi Gas Chemical Company, Inc. (JP) 2014-09-24 EP disclosed
EP-2781501-A1 CYCLIC COMPOUND, METHOD FOR PRODUCING SAME, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN Mitsubishi Gas Chemical Company, Inc. (JP) 2014-09-24 EP disclosed
CN-103576455-A A colored photosensitive resin composition, color filter and liquid crystal display device having the same DONGWOO FINE CHEM CO LTD 2014-02-12 CN disclosed
EP-1804125-B1 METHOD FOR FINE PATTERN FORMATION AZ ELECTRONIC MATERIALS USA (US) 2013-07-24 EP disclosed
US-7592132-B2 Method for fine pattern formation AZ ELECTRONIC MATERIALS USA CORP. (US) 2009-09-22 US disclosed
US-7399582-B2 Material for forming fine pattern and method for forming fine pattern using the same AZ ELECTRONIC MATERIALS USA CORP. (US) 2008-07-15 US disclosed
US-20070248770-A1 Method for Fine Pattern Formation MERCK PATENT GMBH (DE) 2007-10-25 US disclosed
EP-1804125-A1 METHOD FOR FINE PATTERN FORMATION AZ Electronic Materials (Japan) K.K. (JP) 2007-07-04 EP disclosed
US-20060183218-A1 Material for forming fine pattern and method for forming fine pattern using the same MERCK PATENT GMBH (DE) 2006-08-17 US disclosed
EP-1653286-A1 MATERIAL FOR FORMING FINE PATTERN AND METHOD FOR FORMING FINE PATTERN USING THE SAME AZ Electronic Materials USA Corp. (US) 2006-05-03 EP disclosed
US-20040048200-A1 Method for forming fine pattern on substrate by using resist pattern, and resist surface treatment agent RENESAS TECHNOLOGY CORP. (JP) 2004-03-11 US disclosed
US-6602647-B2 Photo acid generator with high transparency and excellent heat stability in a photoresist for lithography using far ultraviolet light, especially light of ArF excimer consists of a cyclic sulfonium compound with 2-oxo group NEC CORPORATION (JP) 2003-08-05 US disclosed
US-20020045122-A1 Sulfonium salt compound and resist composition and pattern forming method using the same NEC CORPORATION 2002-04-18 US disclosed
EP-1113334-A1 Sulfonium salt compound, resist composition comprising the same and pattern forming method using the composition NEC CORPORATION (JP) 2001-07-04 EP disclosed