Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 2/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | FDPS | P14324 | 7/20 | 0.33 |
| ▸ | GGPS1 | O95749 | 4/20 | 0.33 |
| ▸ | THRA | P10827 | 1/20 | 0.33 |
| ▸ | THRB | P10828 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | ATM | Q13315 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bromide SCHEMBL6416514 | 0.80 | CES2 (0.39) | CES2TSHRFDPSGGPS1THRA | |
| Hydrochloric Acid SCHEMBL10384082 | 0.80 | CES2 (0.39) | CES2TSHRFDPSGGPS1THRA | |
| Iodide SCHEMBL6409615 | 0.80 | CES2 (0.39) | CES2TSHRFDPSGGPS1THRA | |
| Bromide SCHEMBL9510259 | 0.80 | CES2 (0.39) | CES2TSHRFDPSGGPS1THRA | |
| Hydrochloric Acid SCHEMBL10384076 | 0.80 | CES2 (0.39) | CES2TSHRFDPSGGPS1THRA | |
| SCHEMBL372482 | 0.74 | ZDHHC20 (0.41) | CES2TSHRFDPSGGPS1THRA | |
| SCHEMBL1143902 | 0.72 | — | — | |
| SCHEMBL9004312 | 0.72 | TDP1 (0.35) | — | |
| SCHEMBL8521468 | 0.71 | CES2 (0.42) | CES2FDPSGGPS1MEN1MAPT | |
| SCHEMBL19939441 | 0.71 | CES2 (0.42) | CES2FDPSGGPS1MEN1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12365815-B2 | Polishing liquid, polishing liquid set, polishing method, and defect suppression method | RESONAC CORPORATION (JP) | 2025-07-22 | — | — | US | disclosed |
| EP-2960314-B1 | POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE | FUJIMI INC (JP) | 2024-06-26 | — | — | EP | disclosed |
| WO-2024095637-A1 | ACTINIC-RAY-CURABLE COMPOSITION AND CURED OBJECT | 三洋化成工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| EP-3159915-B1 | METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET | FUJIMI INC (JP) | 2023-12-06 | — | — | EP | disclosed |
| US-20230295466-A1 | POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFECT SUPPRESSION METHOD | RESONAC CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| US-11649377-B2 | Polishing liquid, polishing liquid set and polishing method | RESONAC CORPORATION (JP) | 2023-05-16 | — | — | US | disclosed |
| EP-3133638-B1 | COMPOSITION FOR POLISHING SILICON WAFERS | FUJIMI INC (JP) | 2021-10-27 | — | — | EP | disclosed |
| EP-2957613-B1 | POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE | FUJIMI INC (JP) | 2020-11-18 | — | — | EP | disclosed |
| US-20200299544-A1 | POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD | RESONAC CORPORATION (JP) | 2020-09-24 | — | — | US | disclosed |
| US-20200283659-A1 | POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, ANDDEFECT SUPPRESSION METHOD | RESONAC CORPORATION (JP) | 2020-09-10 | — | — | US | disclosed |
| EP-2138519-B1 | Porous resin beads and method of producing nucleic acid using the same | NITTO DENKO CORP (JP) | 2011-01-19 | — | — | EP | disclosed |
| US-7838482-B2 | CMP polishing compound and polishing method | HITACHI CHEMICAL CO. LTD. (JP) | 2010-11-23 | — | — | US | disclosed |
| US-7837800-B2 | CMP polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2010-11-23 | — | — | US | disclosed |
| US-20090326210-A1 | POROUS RESIN BEADS AND METHOD OF PRODUCING NUCLEIC ACID USING THE SAME | NITTO DENKO CORPORATION (JP) | 2009-12-31 | — | — | US | disclosed |
| US-20090047786-A1 | CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method | RESONAC CORPORATION (JP) | 2009-02-19 | — | — | US | disclosed |
| US-20080214093-A1 | CMP polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-04 | — | — | US | disclosed |
| EP-1956642-A1 | POLISHING AGENT FOR SILICON OXIDE, LIQUID ADDITIVE, AND METHOD OF POLISHING | Hitachi Chemical Co., Ltd. (JP) | 2008-08-13 | — | — | EP | disclosed |
| US-20070175104-A1 | Polishing slurry for silicon oxide, additive liquid and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| US-20060289826-A1 | Hazardous substance decomposer and process for producing the same | RESONAC CORPORATION (JP) | 2006-12-28 | — | — | US | disclosed |
| US-20060148667-A1 | Cmp polishing compound and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-07-06 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090326210-A1 | POROUS RESIN BEADS AND METHOD OF PRODUCING NUCLEIC ACID USING THE SAME | PCNA, ARID2, PHAX | CES2 3933/4885TSHR 4117/4885FDPS 427/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.