Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ZDHHC20 | Q5W0Z9 | 3/20 | 0.41 |
| ▸ | ZDHHC2 | Q9UIJ5 | 2/20 | 0.41 |
| ▸ | GMNN | O75496 | 1/20 | 0.37 |
| ▸ | USP2 | O75604 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
| ▸ | POLB | P06746 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.37 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.37 |
| ▸ | APEX1 | P27695 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | RECQL | P46063 | 1/20 | 0.37 |
| ▸ | BLM | P54132 | 1/20 | 0.37 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 2/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | CES2 | O00748 | 1/20 | 0.35 |
| ▸ | THRA | P10827 | 4/20 | 0.33 |
| ▸ | THRB | P10828 | 4/20 | 0.33 |
| ▸ | GGPS1 | O95749 | 2/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL10384117 | 0.80 | ZDHHC20 (0.41) | ZDHHC20ZDHHC2GMNNUSP2CYP1A2 | |
| Hydrochloric Acid SCHEMBL10383869 | 0.80 | ZDHHC20 (0.41) | ZDHHC20ZDHHC2GMNNUSP2CYP1A2 | |
| SCHEMBL3935590 | 0.78 | ALDH1A1 (0.37) | ZDHHC20ZDHHC2TSHRTHRB | |
| SCHEMBL372522 | 0.74 | CES2 (0.39) | TSHRCES2THRATHRBGGPS1 | |
| SCHEMBL9004318 | 0.72 | KDM4E (0.31) | TSHR | |
| SCHEMBL1144163 | 0.72 | THRA (0.32) | TSHRTHRATHRB | |
| SCHEMBL24690402 | 0.70 | ZDHHC20 (0.42) | ZDHHC20ZDHHC2TSHRHPGDCES2 | |
| SCHEMBL20937775 | 0.70 | ZDHHC20 (0.42) | ZDHHC20ZDHHC2GMNNUSP2CYP1A2 | |
| SCHEMBL17710489 | 0.70 | GGPS1 (0.39) | CES2GGPS1FDPS | |
| SCHEMBL17710530 | 0.68 | GGPS1 (0.42) | CES2GGPS1FDPS |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12365815-B2 | Polishing liquid, polishing liquid set, polishing method, and defect suppression method | RESONAC CORPORATION (JP) | 2025-07-22 | — | — | US | disclosed |
| EP-2960314-B1 | POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE | FUJIMI INC (JP) | 2024-06-26 | — | — | EP | disclosed |
| EP-3159915-B1 | METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET | FUJIMI INC (JP) | 2023-12-06 | — | — | EP | disclosed |
| US-20230295466-A1 | POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFECT SUPPRESSION METHOD | RESONAC CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| US-11649377-B2 | Polishing liquid, polishing liquid set and polishing method | RESONAC CORPORATION (JP) | 2023-05-16 | — | — | US | disclosed |
| EP-3133638-B1 | COMPOSITION FOR POLISHING SILICON WAFERS | FUJIMI INC (JP) | 2021-10-27 | — | — | EP | disclosed |
| EP-2957613-B1 | POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE | FUJIMI INC (JP) | 2020-11-18 | — | — | EP | disclosed |
| US-20200299544-A1 | POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD | RESONAC CORPORATION (JP) | 2020-09-24 | — | — | US | disclosed |
| US-20200283659-A1 | POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, ANDDEFECT SUPPRESSION METHOD | RESONAC CORPORATION (JP) | 2020-09-10 | — | — | US | disclosed |
| US-10745588-B2 | Silicon wafer polishing composition | FUJIMI INCORPORATED (JP) | 2020-08-18 | — | — | US | disclosed |
| EP-2410558-A2 | Polishing slurry for silicon oxide, additive liquid and polishing method | Hitachi Chemical Co., Ltd. (JP) | 2012-01-25 | — | — | EP | disclosed |
| US-20110028073-A1 | CMP POLISHING SLURRY AND POLISHING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2011-02-03 | — | — | US | disclosed |
| US-7838482-B2 | CMP polishing compound and polishing method | HITACHI CHEMICAL CO. LTD. (JP) | 2010-11-23 | — | — | US | disclosed |
| US-7837800-B2 | CMP polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2010-11-23 | — | — | US | disclosed |
| US-20090047786-A1 | CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method | RESONAC CORPORATION (JP) | 2009-02-19 | — | — | US | disclosed |
| US-20080214093-A1 | CMP polishing slurry and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-04 | — | — | US | disclosed |
| EP-1956642-A1 | POLISHING AGENT FOR SILICON OXIDE, LIQUID ADDITIVE, AND METHOD OF POLISHING | Hitachi Chemical Co., Ltd. (JP) | 2008-08-13 | — | — | EP | disclosed |
| US-20070175104-A1 | Polishing slurry for silicon oxide, additive liquid and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| US-20060289826-A1 | Hazardous substance decomposer and process for producing the same | RESONAC CORPORATION (JP) | 2006-12-28 | — | — | US | disclosed |
| US-20060148667-A1 | Cmp polishing compound and polishing method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-07-06 | — | — | US | disclosed |