SCHEMBL372525

SCHEMBL372525

C=CC(=O)N(C(C)=O)C(C)=O

nearest known ligand 0.47

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.47
TSHR P16473 3/20 0.35
TP53 P04637 1/20 0.35
LMNA P02545 1/20 0.35
FGFR4 P22455 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6379416 0.94 ALDH1A1 (0.47) ALDH1A1TSHRTP53LMNAFGFR4
SCHEMBL27491927 0.84 TSHR (0.35) ALDH1A1TSHR
SCHEMBL181176 0.81 LMNA (0.44) ALDH1A1TSHRLMNAFGFR4
SCHEMBL3622188 0.78 LMNA (0.41) ALDH1A1TSHRLMNAFGFR4
SCHEMBL28441938 0.76 ALDH1A1 (0.41) ALDH1A1TSHRTP53LMNA
SCHEMBL7203144 0.76 ALDH1A1 (0.41) ALDH1A1TSHRTP53LMNA
SCHEMBL11298638 0.74
SCHEMBL8743203 0.73 LMNA (0.44) ALDH1A1TSHRLMNAFGFR4
SCHEMBL7259325 0.72 ALDH1A1 (0.43) ALDH1A1TSHRTP53LMNAFGFR4
SCHEMBL11560204 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 182 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024011356-A1 SEPARATOR AND PREPARATION METHOD THEREFOR, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND ELECTRIC DEVICE 宁德时代新能源科技股份有限公司 2024-01-18 WO claimed
US-6455169-B1 RECEPTOR LAYER COMPRISING DIALKYLAMINO/ALKYL (METH)ACRYLATE, VINYLAMINE, ACRYLAMIDE, N-VINYLPYRIDINE, N-VINYLOXALOLINE, N-VINYLFORMAMIDE, AND DIACETYLACRYLAMIDE TYPE MONOMERS; DISCOLORATION INHIBITION TOMOEGAWA PAPER CO., LTD. (JP) 2002-09-24 US claimed
JP-56052744-A None JP disclosed
US-12365815-B2 Polishing liquid, polishing liquid set, polishing method, and defect suppression method RESONAC CORPORATION (JP) 2025-07-22 US disclosed
CN-119301205-A Dispersion, structure, and method for producing structure 三菱化学株式会社 2025-01-10 CN disclosed
US-20240400835-A1 WATER-BASED PRIMER-SURFACER AND USES THEREOF PPG INDUSTRIES OHIO, INC. (US) 2024-12-05 US disclosed
EP-4416202-A1 WATER-BASED PRIMER-SURFACER AND USES THEREOF PPG Industries Ohio Inc. (US) 2024-08-21 EP disclosed
EP-2960314-B1 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE FUJIMI INC (JP) 2024-06-26 EP disclosed
CN-118103422-A Water-borne primer-surfacer and use thereof PPG工业俄亥俄公司 2024-05-28 CN disclosed
WO-2024011356-A1 SEPARATOR AND PREPARATION METHOD THEREFOR, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND ELECTRIC DEVICE 宁德时代新能源科技股份有限公司 2024-01-18 WO disclosed
CN-115003873-B Nonwoven fabric 花王株式会社 2024-01-05 CN disclosed
US-5120360-A Microcapsule-containing ink composition for flexographic printing KANZAKI PAPER MANUFACTURING CO., LTD. (JP) 1992-06-09 US disclosed
EP-0351814-A2 Poly (N-cyclic iminoether), processes for production thereof, thermosetting composition containing it and thermoset resin TEIJIN LIMITED (JP) 1990-01-24 EP disclosed
US-4856857-A Hologram DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) 1989-08-15 US disclosed
EP-0201323-A2 Article incorporating a transparent hologramm DAI NIPPON INSATSU KABUSHIKI KAISHA (JP) 1986-11-12 EP disclosed
EP-0075206-B1 PROCESS FOR THE PREPARATION OF COATINGS BASF Aktiengesellschaft (DE) 1984-07-04 EP disclosed
US-4346012-A DIPPING IN SOLUTION OR DISPERSION OR ORGANO-FLUORINE COMPOUND OR POLYMER DAINIPPON INK & CHEMICALS, INC. (JP) 1982-08-24 US disclosed
EP-0019795-B1 POWDERY FIRE-EXTINGUISHING AGENT, AND PROCESS FOR ITS PREPARATION DAINIPPON INK AND CHEMICALS, INC. (JP) 1982-01-27 EP disclosed
JP-S5652744-A PHOTOSENSITIVE POLYAMIDE COMPOSITION UNITIKA LTD 1981-05-12 JP disclosed
US-4115370-A CROSSLINKING WITH VINYL MONOMERS SNIA VISCOSA SOCIETA' NAZIONALE INDUSTRIA APPLICAZIONI VISCOSA S.P.A. (IT) 1978-09-19 US disclosed