SCHEMBL3728620

SCHEMBL3728620

CCCCCCCCCCCc1nc(C=O)c(C=O)[nH]1

nearest known ligand 0.45

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 5/20 0.45
HIF1A Q16665 1/20 0.41
EPAS1 Q99814 1/20 0.41
ALDH1A1 P00352 1/20 0.41
PKM P14618 1/20 0.41
HPGD P15428 1/20 0.41
PARP1 P09874 1/20 0.38
PI4KA P42356 1/20 0.37
PI4K2B Q8TCG2 1/20 0.37
PI4K2A Q9BTU6 1/20 0.37
PI4KB Q9UBF8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3735333 0.93 PARP1 (0.43) GPR84HIF1AEPAS1ALDH1A1PARP1
SCHEMBL4354597 0.78 ADORA1 (0.38)
SCHEMBL17949542 0.76 ALDH1A1 (0.41) GPR84ALDH1A1PARP1
SCHEMBL9195142 0.75 PARP1 (0.47) ALDH1A1PARP1
SCHEMBL1257638 0.75 ALDH1A1 (0.40) GPR84HIF1AEPAS1ALDH1A1PARP1
SCHEMBL8438737 0.75 ALDH1A1 (0.40) GPR84HIF1AALDH1A1PARP1PI4KA
SCHEMBL2454194 0.75 PARP1 (0.42) GPR84HIF1AALDH1A1PARP1
SCHEMBL9123535 0.75 PARP1 (0.42) GPR84HIF1AALDH1A1PARP1
SCHEMBL12468314 0.70 PARP1 (0.42) GPR84HIF1AEPAS1PARP1
SCHEMBL9194922 0.69 PARP1 (0.47) PARP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8193258-B2 Sealant composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-06-05 US claimed
US-20100280143-A1 SEALANT COMPOSITION INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2010-11-04 US claimed
US-8193258-B2 Sealant composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-06-05 US disclosed
US-20100280143-A1 SEALANT COMPOSITION INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2010-11-04 US disclosed
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed