Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PARP1 | P09874 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | GPR84 | Q9NQS5 | 5/20 | 0.38 |
| ▸ | GSK3B | P49841 | 1/20 | 0.37 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.34 |
| ▸ | EPAS1 | Q99814 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3728620 | 0.93 | GPR84 (0.45) | PARP1ALDH1A1GPR84HIF1AEPAS1 | |
| SCHEMBL4352906 | 0.89 | GLA (0.38) | PARP1GPR84 | |
| SCHEMBL17949542 | 0.82 | ALDH1A1 (0.41) | PARP1ALDH1A1MAPK1GPR84GSK3B | |
| SCHEMBL4354597 | 0.81 | ADORA1 (0.38) | — | |
| SCHEMBL9195142 | 0.81 | PARP1 (0.47) | PARP1ALDH1A1GSK3B | |
| SCHEMBL2454194 | 0.81 | PARP1 (0.42) | PARP1ALDH1A1MAPK1GPR84GSK3B | |
| SCHEMBL1257638 | 0.81 | ALDH1A1 (0.40) | PARP1ALDH1A1MAPK1GPR84GSK3B | |
| SCHEMBL8438737 | 0.81 | ALDH1A1 (0.40) | PARP1ALDH1A1MAPK1GPR84GSK3B | |
| SCHEMBL9123535 | 0.81 | PARP1 (0.42) | PARP1ALDH1A1MAPK1GPR84GSK3B | |
| SCHEMBL9194922 | 0.75 | PARP1 (0.47) | PARP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8193258-B2 | Sealant composition | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2012-06-05 | — | — | US | claimed |
| US-20100280143-A1 | SEALANT COMPOSITION | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2010-11-04 | — | — | US | claimed |
| US-8193258-B2 | Sealant composition | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2012-06-05 | — | — | US | disclosed |
| US-20100280143-A1 | SEALANT COMPOSITION | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2010-11-04 | — | — | US | disclosed |
| US-7614145-B2 | Method for manufacturing multilayer circuit board and resin base material | ZEON CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| CN-100496195-C | Mulitilayer circuit board, resin base material, and its production method | ZEON CORP (JP) | 2009-06-03 | — | — | CN | disclosed |
| US-20080217617-A1 | Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same | ZEON CORPORATION (JP) | 2008-09-11 | — | — | US | disclosed |
| CN-100383278-C | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board | ZEON CORP (JP) | 2008-04-23 | — | — | CN | disclosed |
| US-20050153059-A1 | Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board | ZEON CORPORATION (JP) | 2005-07-14 | — | — | US | disclosed |
| CN-1639384-A | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board | ZEON CORP (JP) | 2005-07-13 | — | — | CN | disclosed |
| US-20040237295-A1 | Multilayer circuit board and resin base material, and its production method | ZEON CORPORATION (JP) | 2004-12-02 | — | — | US | disclosed |
| CN-1552174-A | Mulitilayer circuit board, resin base material, and its production method | �ձ�������ʽ���� | 2004-12-01 | — | — | CN | disclosed |