SCHEMBL4354597

SCHEMBL4354597

CCc1nc(C=O)c(C=O)[nH]1

nearest known ligand 0.38

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ADORA1 P30542 4/20 0.38
ADORA3 P0DMS8 3/20 0.38
ADORA2A P29274 2/20 0.38
TNKS2 Q9H2K2 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.35
TP53 P04637 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
ALK Q9UM73 1/20 0.33
DDAH1 O94760 1/20 0.33
GAA P10253 2/20 0.32
HTT P42858 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4352906 0.84 GLA (0.38) ADORA1ADORA3ADORA2A
SCHEMBL3735333 0.81 PARP1 (0.43)
SCHEMBL2033187 0.79 ALK (0.46) ADORA1ADORA3ADORA2ATNKS2SMN1; SMN2
SCHEMBL811725 0.79 TP53 (0.41) ADORA1ADORA3ADORA2ATNKS2SMN1; SMN2
SCHEMBL3728620 0.78 GPR84 (0.45)
SCHEMBL5216794 0.78 GAA (0.38) ADORA1ADORA3ADORA2ATNKS2SMN1; SMN2
SCHEMBL3027900 0.78 GAA (0.38) ADORA1ADORA3ADORA2ATNKS2DDAH1
SCHEMBL5216962 0.78 ADORA1 (0.36) ADORA1ADORA3ADORA2ATNKS2SMN1; SMN2
SCHEMBL4353310 0.71 ADORA3 (0.31) ADORA3L3MBTL1
SCHEMBL548488 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed