Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL313536 | 0.88 | MAPT (0.37) | HSD17B10 | |
| SCHEMBL9577001 | 0.77 | — | — | |
| Hexamethylolmelamine SCHEMBL762278 | 0.75 | ALDH1A1 (0.33) | — | |
| SCHEMBL3430474 | 0.74 | HSD17B10 (0.37) | HSD17B10 | |
| SCHEMBL5804830 | 0.72 | HSD17B10 (0.36) | HSD17B10 | |
| SCHEMBL5791910 | 0.72 | — | — | |
| SCHEMBL10882318 | 0.71 | — | — | |
| SCHEMBL9504245 | 0.71 | MAPT (0.32) | — | |
| SCHEMBL195901 | 0.68 | NPSR1 (0.57) | — | |
| SCHEMBL63308 | 0.68 | ALDH1A1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3817524-B1 | METHOD OF MANUFACTURING PRINTED WIRING BOARD | DAINIPPON INK & CHEMICALS (JP) | 2025-07-02 | — | — | EP | disclosed |
| EP-3817523-B1 | METHOD OF MANUFACTURING PRINTED WIRING BOARD | DAINIPPON INK & CHEMICALS (JP) | 2025-07-02 | — | — | EP | disclosed |
| WO-2022097483-A1 | MULTILAYER BODY FOR SEMI-ADDITIVE PROCESS AND PRINTED WIRING BOARD USING SAME | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022097486-A1 | METAL FILM FORMATION METHOD | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022097484-A1 | LAMINATE FOR SEMI-ADDITIVE MANUFACTURING AND PRINTED WIRING BOARD USING SAME | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022097487-A1 | METAL FILM FORMATION METHOD | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022097485-A1 | LAMINATE FOR SEMI-ADDITIVE MANUFACTURING AND PRINTED WIRING BOARD USING SAME | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022097481-A1 | LAMINATE FOR SEMI-ADDITIVE MANUFACTURING AND PRINTED WIRING BOARD USING SAME | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022097479-A1 | LAMINATE FOR SEMI-ADDITIVE MANUFACTURING AND PRINTED WIRING BOARD USING SAME | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| WO-2022097482-A1 | LAMINATE FOR SEMI-ADDITIVE MANUFACTURING AND PRINTED WIRING BOARD USING SAME | DIC株式会社 | 2022-05-12 | — | — | WO | disclosed |
| US-20180162106-A1 | LAMINATED BODY, MOLDED ARTICLE, ELECTROCONDUCTIVE PATTERN, ELECTRONIC CIRCUIT, AND ELECTROMAGNETIC SHIELD | DIC CORPORATION (JP) | 2018-06-14 | — | — | US | disclosed |
| EP-3315302-A1 | LAMINATED BODY, MOLDED ARTICLE, ELECTROCONDUCTIVE PATTERN, ELECTRONIC CIRCUIT, AND ELECTROMAGNETIC SHIELD | DIC Corporation (JP) | 2018-05-02 | — | — | EP | disclosed |
| US-20160198594-A1 | CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN | DAINIPPON INK & CHEMICALS (JP) | 2016-07-07 | — | — | US | disclosed |
| US-20150060132-A1 | CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN | DIC CORPORATION (JP) | 2015-03-05 | — | — | US | disclosed |
| EP-2833705-A1 | ELECTROCONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN | DIC Corporation (JP) | 2015-02-04 | — | — | EP | disclosed |
| EP-2684931-A1 | HEAT SEALANT, AND LAMINATE AND SOLAR-CELL MODULE USING SAME | DIC Corporation (JP) | 2014-01-15 | — | — | EP | disclosed |
| US-20130340816-A1 | HEAT-SEALING MATERIAL, LAMINATED BODY, AND SOLAR-CELL MODULE USING THE SAME | DIC CORPORATION (JP) | 2013-12-26 | — | — | US | disclosed |
| US-7824583-B2 | Flame inhibiting and retarding chemical compositions for general use on multiple solid surfaces | GANG HENRY | 2010-11-02 | — | — | US | disclosed |
| US-5204204-A | Carrier core particles and resin-coating layers | MINOLTA CAMERA KABUSHIKI KAISHA (JP) | 1993-04-20 | — | — | US | disclosed |
| US-4076870-A | HEAT TREATMENT IN PRESENCE OF A FLUOROCARBOXYLIC ACID CATALYST | DAIDO-MARUTA FINISHING CO. LTD. (JA) | 1978-02-28 | — | — | US | disclosed |