SCHEMBL3743371

SCHEMBL3743371

CC(C)(c1ccccc1Oc1ccccc1N)c1ccccc1C(C)(C)c1ccccc1Oc1ccccc1N

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.47
ADRA2B P18089 1/20 0.47
PTGS1 P23219 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
MAPT P10636 2/20 0.46
KDM4E B2RXH2 1/20 0.46
CRHBP P24387 1/20 0.46
CRHR2 Q13324 1/20 0.46
GAA P10253 2/20 0.43
RCE1 Q9Y256 1/20 0.42
CYP1A2 P05177 2/20 0.39
CYP2C19 P33261 2/20 0.39
CYP2C9 P11712 1/20 0.39
CYP3A4 P08684 2/20 0.38
IKBKB O14920 1/20 0.37
BRAF P15056 1/20 0.37
TLR4 O00206 1/20 0.34
MEN1 O00255 1/20 0.34
LMNA P02545 1/20 0.34
KMT2A Q03164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1966245 0.98 ALDH1A1 (0.48) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL30530134 0.98 ALDH1A1 (0.48) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL1501337 0.87 ALDH1A1 (0.42) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL397028 0.86 ALDH1A1 (0.48) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL6902838 0.85 ALDH1A1 (0.39) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL10392465 0.82 ALDH1A1 (0.54) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL1339067 0.78 KDM4E (0.52) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL29508342 0.78 KDM4E (0.65) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL30979203 0.78 KDM4E (0.65) ALDH1A1ADRA2BPTGS1TDP1MAPT
SCHEMBL81185 0.78 KDM4E (0.65) ALDH1A1ADRA2BPTGS1TDP1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-8059826-A None JP disclosed
US-7838114-B2 flexible printed circuits; dielectric, flowability, heat resistance, adhesiveness, and processability; a polyimide resin, an monomeric aromatic amine, an epoxy resin (polyepoxide), and an imidazole compound; 1,3-bis(3-aminophenoxy)benzene KANEKA CORPORATION (JP) 2010-11-23 US disclosed
US-20080230261-A1 Thermosetting Resin Composition and Use Thereof KANEKA CORPORATION (JP) 2008-09-25 US disclosed
JP-H0859826-A POLYAMIDE AND HEAT-RESISTANT ADHESIVE PREPARED THEREFROM MITSUI TOATSU CHEM INC 1996-03-05 JP disclosed