SCHEMBL374823

SCHEMBL374823

CSc1nc2c(C)cccc2[nH]1

nearest known ligand 0.59

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.59
TDP1 Q9NUW8 1/20 0.59
MGAM O43451 15/20 0.54
GAA P10253 15/20 0.54
SI P14410 15/20 0.54
MGAM2 Q2M2H8 15/20 0.54
ESR1 P03372 1/20 0.51
CBFB Q13951 1/20 0.51
ADORA3 P0DMS8 1/20 0.48
ADORA2A P29274 1/20 0.48
ADORA1 P30542 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10516716 0.84 ALDH1A1 (0.57) ALDH1A1TDP1MGAMGAASI
SCHEMBL1170892 0.80 MGAM (0.71) MGAMGAASIMGAM2ESR1
SCHEMBL8601516 0.80 TDP1 (0.50) ALDH1A1TDP1MGAMGAASI
SCHEMBL3967441 0.80 ALDH1A1 (0.40) ALDH1A1TDP1MGAMGAASI
SCHEMBL353891 0.76 PARP1 (0.56) MGAMGAASIMGAM2ESR1
SCHEMBL3968918 0.76 MEN1 (0.42) ALDH1A1TDP1MGAMGAASI
SCHEMBL3968187 0.76 ALDH1A1 (0.43) ALDH1A1TDP1ADORA3ADORA2AADORA1
SCHEMBL7969798 0.75 DHODH (0.58) ALDH1A1TDP1
SCHEMBL21212784 0.75 PDK2 (0.40) ALDH1A1TDP1ADORA3ADORA2AADORA1
SCHEMBL12195163 0.75 ALDH1A1 (0.71) ALDH1A1TDP1MGAMGAASI

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2410010-B1 Improved lead-free insulation compositions containing metallocene polymers GEN CABLE TECHNOLOGIES CORP (US) 2019-03-13 EP disclosed
EP-1948728-B1 IMPROVED LEAD-FREE INSULATION COMPOSITIONS CONTAINING METALLOCENE POLYMERS GEN CABLE TECHNOLOGIES CORP (US) 2019-03-13 EP disclosed
EP-2311049-B1 IMPROVED HARD GRADE EPR INSULATION COMPOSITIONS GEN CABLE TECHNOLOGIES CORP (US) 2014-08-27 EP disclosed
EP-2410010-A1 Improved lead-free insulation compositions containing metallocene polymers General Cable Technologies Corporation (US) 2012-01-25 EP disclosed
US-7989126-B2 Metal mercaptoimidazoles containing photoconductors XEROX CORPORATION (US) 2011-08-02 US disclosed
EP-2311049-A2 IMPROVED HARD GRADE EPR INSULATION COMPOSITIONS General Cable Technologies Corporation (US) 2011-04-20 EP disclosed
US-7858711-B2 Lead-free insulation compositions containing metallocene polymers General CableTechnologies Corporation (US) 2010-12-28 US disclosed
US-20100022683-A1 HARD GRADE EPR INSULATION COMPOSITIONS GENERAL CABLE TECHNOLOGIES CORPORATION (US) 2010-01-28 US disclosed
WO-2010011418-A2 IMPROVED HARD GRADE EPR INSULATION COMPOSITIONS GENERAL CABLE TECHNOLOGIES CORPORATION (US) 2010-01-28 WO disclosed
US-20090274965-A1 METAL MERCAPTOIMIDAZOLES CONTAINING PHOTOCONDUCTORS XEROX CORPORATION (US) 2009-11-05 US disclosed
US-7473742-B2 Lead-free insulation compositions containing metallocene polymers GENERAL CABLE TECHNOLOGIES CORP. (US) 2009-01-06 US disclosed
EP-1948728-A2 IMPROVED LEAD-FREE INSULATION COMPOSITIONS CONTAINING METALLOCENE POLYMERS General Cable Technologies Corporation (US) 2008-07-30 EP disclosed
US-20070213433-A1 Polymer may be metallocene based, non metallocene based, hindered amine light stabilizers, mercapto compounds, and optionally, amine antioxidants, improved electrical and mechanical properties; without use of custom polymers such as elastomer terpolymer containing 5-vinyl-2-norbornene as base resin GENERAL CABLE TECHNOLOGIES CORPORATION 2007-09-13 US disclosed
US-20070100032-A1 Lead-free insulation compositions containing metallocene polymers GENERAL CABLE TECHNOLOGIES CORPORATION 2007-05-03 US disclosed
WO-2007050688-A2 IMPROVED LEAD-FREE INSULATION COMPOSITIONS CONTAINING METALLOCENE POLYMERS GENERAL CABLE TECHNOLOGIES CORPORATION (US) 2007-05-03 WO disclosed