SCHEMBL375453

SCHEMBL375453

C=CC(CC(=O)O)C(=O)OC(=O)C(C=C)CC(=O)O

nearest known ligand 0.35

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.35
TSHR P16473 2/20 0.34
SLC6A2 P23975 1/20 0.34
SLC6A4 P31645 1/20 0.34
BLM P54132 1/20 0.34
SLC6A3 Q01959 1/20 0.34
MEN1 O00255 1/20 0.34
CYP2D6 P10635 1/20 0.34
NFKB1 P19838 1/20 0.34
CYP2C19 P33261 1/20 0.34
KMT2A Q03164 1/20 0.34
TDP1 Q9NUW8 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.32
GABRR1 P24046 2/20 0.30
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27524461 0.88 ALOX15 (0.35) SLC22A6TSHRSLC6A2SLC6A4BLM
SCHEMBL6844385 0.84 TSHR (0.35) SLC22A6TSHRSLC6A2SLC6A4BLM
SCHEMBL5415893 0.83 SLC6A2 (0.32) SLC22A6TSHRSLC6A2SLC6A4BLM
SCHEMBL8973164 0.83 SLC6A2 (0.32) SLC22A6TSHRSLC6A2SLC6A4BLM
SCHEMBL27839156 0.81 HCAR2 (0.36) TSHRMEN1CYP2D6KMT2ASMN1; SMN2
SCHEMBL27970341 0.80 PDE4A (0.43) TDP1LMNA
SCHEMBL1201311 0.78 TDP1 (0.43) SLC22A6TSHRSLC6A2SLC6A4BLM
Hydrochloric Acid SCHEMBL27774490 0.76 TDP1 (0.42) SLC22A6TSHRSLC6A2SLC6A4BLM
SCHEMBL2679188 0.74 TSHR (0.40) SLC22A6TSHRSLC6A2SLC6A4BLM
SCHEMBL28485279 0.74 SLC22A6 (0.36) SLC22A6TSHRSLC6A2SLC6A4BLM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260042886-A1 RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI GAS CHEMICAL CO (JP) 2026-02-12 US disclosed
EP-4674912-A1 THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE Toray Industries, Inc. (JP) 2026-01-07 EP disclosed
US-12486398-B2 Fiber-reinforced polyamide resin composition molded article TORAY INDUSTRIES, INC. (JP) 2025-12-02 US disclosed
EP-4563661-A1 RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-06-04 EP disclosed
EP-4563660-A1 RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-06-04 EP disclosed
WO-2025028319-A1 ARTIFICIAL FEATHER FOR SHUTTLECOCK ヨネックス株式会社 2025-02-06 WO disclosed
EP-4477705-A1 STYRENE-BASED THERMOPLASTIC ELASTOMER COMPOSITION MCPP Innovation LLC (JP) 2024-12-18 EP disclosed
US-20240392125-A1 STYRENIC THERMOPLASTIC ELASTOMER COMPOSITION MCPP INNOVATION LLC (JP) 2024-11-28 US disclosed
WO-2024181336-A1 THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE 東レ株式会社 2024-09-06 WO disclosed
US-20240166872-A1 POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE OBTAINED BY MOLDING SAME TORAY INDUSTRIES, INC. (JP) 2024-05-23 US disclosed
US-20110021707-A1 PROCESS FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2011-01-27 US disclosed
EP-2270073-A1 PROCESS FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION Toray Industries, Inc. (JP) 2011-01-05 EP disclosed
US-20100273944-A1 THERMOPLASTIC RESIN COMPOSITION, PRODUCTION METHOD THEREOF, AND MOLDED ARTICLE TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2010-10-28 US disclosed
US-20090202851-A1 Heat shrinkable multilayer film and heat shrinkable label GUNZE LIMITED (JP) 2009-08-13 US disclosed
EP-2039507-A1 HEAT SHRINKABLE MULTILAYER FILM AND HEAT SHRINKABLE LABEL GUNZE LIMITED (JP) 2009-03-25 EP disclosed
EP-2017306-A1 THERMOPLASTIC RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME AND MOLDING TORAY INDUSTRIES, INC. (JP) 2009-01-21 EP disclosed
US-6815080-B2 GAS-BARRIER PROPERTY, IMPACT STRENGTH, FLUIDITY UPON MELTING AND, THEREFORE, A GOOD INJECTION MOLDABILITY MITSUBISHI CHEMICAL CORPORATION (JP) 2004-11-09 US disclosed
EP-1466724-A2 Thermoplastic resin composition and multi-layer laminate Mitsubishi Chemical Corporation (JP) 2004-10-13 EP disclosed
US-20040006182-A1 Thermoplastic resin composition and multi-layer laminate MITSUBISHI CHEMICAL CORPORATION (JP) 2004-01-08 US disclosed
EP-0473823-A1 Laminate and process for producing the same SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-03-11 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260042886-A1 RESIN COMPOSITION AND MOLDED ARTICLE CAD, HACD3, DAP3 SLC22A6 4210/4885TSHR 4182/4885SLC6A2 3740/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.