SCHEMBL375528

SCHEMBL375528

CCCO[Si](C)(CCCS)OCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL375869 0.89 ADRB2 (0.32)
SCHEMBL14191177 0.87
SCHEMBL19641540 0.86
SCHEMBL705777 0.85
SCHEMBL707266 0.85
SCHEMBL375555 0.85 THRB (0.32)
SCHEMBL4539608 0.85 THRB (0.32)
SCHEMBL1609048 0.83 ADRB2 (0.32)
SCHEMBL375947 0.82
SCHEMBL22661031 0.81 ADRB2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 283 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7518009-B2 Process for preparing mercaptoorganyl (alkoxysilanes) EVONIK DEGUSSA GMBH (DE) 2009-04-14 US claimed
US-20060252952-A1 Process for preparing mercaptoorganyl (alkoxysilanes) DEGUSSA AG (DE) 2006-11-09 US claimed
US-12617238-B2 Pneumatic tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2026-05-05 US disclosed
US-12545055-B2 Tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2026-02-10 US disclosed
US-12515483-B2 Tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2026-01-06 US disclosed
US-12515477-B2 Pneumatic tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2026-01-06 US disclosed
US-12508840-B2 Tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2025-12-30 US disclosed
US-12502912-B2 Tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2025-12-23 US disclosed
EP-4112334-B1 TIRE SUMITOMO RUBBER IND (JP) 2025-08-20 EP disclosed
EP-4600051-A1 TIRE Sumitomo Rubber Industries, Ltd. (JP) 2025-08-13 EP disclosed
US-20250215200-A1 SEALING APPARATUS NOK CORPORATION (JP) 2025-07-03 US disclosed
EP-1619692-A1 PROTON-CONDUCTIVE FILM, PROCESS FOR PRODUCING THE SAME, AND FUEL CELL EMPOLYING THE PROTON-CONDUCTIVE FILM SEKISUI CHEMICAL CO., LTD. (JP) 2006-01-25 EP disclosed
EP-1607423-A1 AQUEOUS SILYLATED URETHANE COMPOSITION, AQUEOUS ADHESIVES FOR WRAPPING, AND AQUEOUS CONTACT ADHESIVES Konishi Co., Ltd. (JP) 2005-12-21 EP disclosed
EP-1592025-A1 PROTON CONDUCTING FILM, METHOD FOR PRODUCING THE SAME, AND FUEL CELL USING THE SAME SEKISUI CHEMICAL CO., LTD. (JP) 2005-11-02 EP disclosed
US-20050124822-A1 Process for the preparation of (mercaptoorganyl)alkoxysilanes EVONIK OPERATIONS GMBH (DE) 2005-06-09 US disclosed
US-20050124821-A1 Process for preparing (mercaptoorganyl)alkoxysilanes EVONIK OPERATIONS GMBH (DE) 2005-06-09 US disclosed
EP-1538152-A1 Process for the preparation of (mercaptoorganyl)-alkoxysilanen Degussa AG (DE) 2005-06-08 EP disclosed
EP-1529782-A1 Process for preparing mercaptoorganyl alkoxy silanes Degussa AG (DE) 2005-05-11 EP disclosed
US-20040132864-A1 Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive KONISHI CO., LTD. (JP) 2004-07-08 US disclosed
EP-1431366-A1 SELF&amp;minus;REACTIVE&amp;sol;CURABLE WATER&amp;minus;BASED SOLID ADHESIVE AND METHOD OF BONDING WITH THE SELF&amp;minus;REACTIVE&amp;sol;CURABLE WATER&amp;minus;BASED SOLID ADHESIVE KONISHI CO., LTD. (JP) 2004-06-23 EP disclosed