⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22468992 | 0.94 | — | — | |
| SCHEMBL16871837 | 0.91 | — | — | |
| SCHEMBL375706 | 0.88 | — | — | |
| SCHEMBL374928 | 0.84 | THRB (0.40) | — | |
| SCHEMBL26116415 | 0.83 | — | — | |
| SCHEMBL2549917 | 0.82 | DNM1 (0.31) | — | |
| SCHEMBL376088 | 0.79 | — | — | |
| SCHEMBL22468978 | 0.78 | THRB (0.39) | — | |
| SCHEMBL16909985 | 0.77 | LMNA (0.30) | — | |
| SCHEMBL2549936 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7518009-B2 | Process for preparing mercaptoorganyl (alkoxysilanes) | EVONIK DEGUSSA GMBH (DE) | 2009-04-14 | — | — | US | claimed |
| US-20060252952-A1 | Process for preparing mercaptoorganyl (alkoxysilanes) | DEGUSSA AG (DE) | 2006-11-09 | — | — | US | claimed |
| US-20250215200-A1 | SEALING APPARATUS | NOK CORPORATION (JP) | 2025-07-03 | — | — | US | disclosed |
| EP-4502033-A1 | SEALING DEVICE | NOK Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-12139635-B2 | Coatings for waterproofing electronic components | HENKEL AG & CO. KGAA (DE) | 2024-11-12 | — | — | US | disclosed |
| CN-117916309-A | Acrylic rubber composition | 株式会社大阪曹达 | 2024-04-19 | — | — | CN | disclosed |
| WO-2023190825-A1 | SEALING DEVICE | NOK株式会社 | 2023-10-05 | — | — | WO | disclosed |
| US-20220002559-A1 | COATINGS FOR WATERPROOFING ELECTRONIC COMPONENTS | HENKEL AG & CO. KGAA (DE) | 2022-01-06 | — | — | US | disclosed |
| WO-2020197963-A1 | COATINGS FOR WATERPROOFING ELECTRONIC COMPONENTS | HENKEL AG & CO. KGAA (DE) | 2020-10-01 | — | — | WO | disclosed |
| US-10563047-B2 | Rubber composition and pneumatic tire including the same | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2020-02-18 | — | — | US | disclosed |
| EP-3156444-B1 | RUBBER COMPOSITION AND PNEUMATIC TIRE USING SAME | YOKOHAMA RUBBER CO LTD (JP) | 2019-07-24 | — | — | EP | disclosed |
| EP-1538152-B1 | Process for the preparation of (mercaptoorganyl)-alkoxysilanen | DEGUSSA (DE) | 2006-03-22 | — | — | EP | disclosed |
| EP-1634884-A1 | Process for preparing mercaptoorganyl alkoxy silanes | Degussa GmbH (DE) | 2006-03-15 | — | — | EP | disclosed |
| US-20060052622-A1 | Process for the preparation of mercaptoorganyl (alkoxysilanes) | EVONIK DEGUSSA GMBH (DE) | 2006-03-09 | — | — | US | disclosed |
| US-20060052621-A1 | Process for producing mercaptoorganyl (alkoxysilane) | EVONIK DEGUSSA GMBH (DE) | 2006-03-09 | — | — | US | disclosed |
| US-6995280-B2 | Process for preparing (mercaptoorganyl)alkoxysilanes | DEGUSSA AG (DE) | 2006-02-07 | — | — | US | disclosed |
| US-20050124822-A1 | Process for the preparation of (mercaptoorganyl)alkoxysilanes | EVONIK OPERATIONS GMBH (DE) | 2005-06-09 | — | — | US | disclosed |
| US-20050124821-A1 | Process for preparing (mercaptoorganyl)alkoxysilanes | EVONIK OPERATIONS GMBH (DE) | 2005-06-09 | — | — | US | disclosed |
| EP-1538152-A1 | Process for the preparation of (mercaptoorganyl)-alkoxysilanen | Degussa AG (DE) | 2005-06-08 | — | — | EP | disclosed |
| EP-1529782-A1 | Process for preparing mercaptoorganyl alkoxy silanes | Degussa AG (DE) | 2005-05-11 | — | — | EP | disclosed |