SCHEMBL3786529

SCHEMBL3786529

C1CCC(CCCOCC2CO2)CC1

nearest known ligand 0.63

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.63
SMN1; SMN2 Q16637 2/20 0.55
ALDH1A1 P00352 3/20 0.52
TDP1 Q9NUW8 1/20 0.52
SPHK2 Q9NRA0 4/20 0.43
SPHK1 Q9NYA1 4/20 0.43
MAPK1 P28482 1/20 0.42
CYP1A2 P05177 1/20 0.42
SIGMAR1 Q99720 3/20 0.39
EPHX1 P07099 1/20 0.39
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
HRH3 Q9Y5N1 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27489352 0.93 TSHR (0.64) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
SCHEMBL27508747 0.93 TSHR (0.64) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
SCHEMBL9716217 0.93 TSHR (0.64) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
SCHEMBL28495305 0.93 TSHR (0.64) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
SCHEMBL27487263 0.91 TSHR (0.67) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
SCHEMBL20579953 0.90 TSHR (0.59) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
SCHEMBL11053466 0.85 MEN1 (0.47) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
Butylcyclohexane SCHEMBL28147520 0.84 CYP1A2 (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL22826269 0.82 TSHR (0.72) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2
SCHEMBL27731751 0.81 TSHR (0.64) TSHRSMN1; SMN2ALDH1A1TDP1SPHK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7524594-B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC (US) 2009-04-28 US claimed
EP-1778759-B1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES PROMERUS LLC (US) 2008-11-12 EP claimed
EP-1778759-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES Promerus, LLC (US) 2007-05-02 EP claimed
WO-2006017035-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES PROMERUS LLC (US) 2006-02-16 WO claimed
US-20060008734-A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films SUMITOMO BAKELITE CO., LTD. (JP) 2006-01-12 US claimed
US-20250110403-A1 PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC POLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF PROMERUS, LLC (US) 2025-04-03 US disclosed
WO-2025072614-A2 PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC POLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF PROMERUS, LLC (US) 2025-04-03 WO disclosed
WO-2025072607-A1 PHOTOSENSITIVE COMPOSITION CONTAINING PFAS FREE POLYCYCLOOLEFINIC TERPOLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF PROMERUS, LLC (US) 2025-04-03 WO disclosed
US-20240336599-A1 PHOTOSENSITIVE POLYAMIC ACID AND DIAZIRINE COMPOSITIONS PROMERUS, LLC (US) 2024-10-10 US disclosed
US-11537045-B2 Photosensitive compositions and applications thereof PROMERUS, LLC (US) 2022-12-27 US disclosed
EP-4045564-A1 PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF Promerus, LLC (US) 2022-08-24 EP disclosed
CN-114555674-A Photosensitive composition and application thereof 普罗米鲁斯有限责任公司 2022-05-27 CN disclosed
WO-2013109529-A1 THERMO-OXIDATIVELY STABLE, SIDE CHAIN POLYETHER FUNCTIONALIZED POLYNORBORNENES FOR MICROELECTRONIC AND OPTOELECTRONIC DEVICES AND ASSEMBLIES THEREOF PROMERUS LLC (US) 2013-07-25 WO disclosed
US-7858721-B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC (US) 2010-12-28 US disclosed
US-20090215976-A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC 2009-08-27 US disclosed
US-7524594-B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films PROMERUS LLC (US) 2009-04-28 US disclosed
EP-1778759-B1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES PROMERUS LLC (US) 2008-11-12 EP disclosed
EP-1778759-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES Promerus, LLC (US) 2007-05-02 EP disclosed
WO-2006017035-A1 PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES PROMERUS LLC (US) 2006-02-16 WO disclosed
US-20060008734-A1 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films SUMITOMO BAKELITE CO., LTD. (JP) 2006-01-12 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240336599-A1 PHOTOSENSITIVE POLYAMIC ACID AND DIAZIRINE COMPOSITIONS PUF60, FTO, PARN TSHR 4589/4885SMN1; SMN2 1495/4885ALDH1A1 2713/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.