SCHEMBL381565

SCHEMBL381565

COc1ccc(Cc2cccc(P)c2Cc2ccc(OC)cc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 1/20 0.50
ALDH1A1 P00352 2/20 0.45
CYP2D6 P10635 1/20 0.45
ATM Q13315 1/20 0.45
LMNA P02545 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
MAOB P27338 1/20 0.40
IDO1 P14902 1/20 0.40
SLC6A4 P31645 1/20 0.40
NPSR1 Q6W5P4 1/20 0.39
SIGMAR1 Q99720 1/20 0.39
CYP11B1 P15538 2/20 0.39
CYP11B2 P19099 2/20 0.39
VKORC1 Q9BQB6 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6542610 0.86 LTA4H (0.62) LTA4HSMN1; SMN2MAOBIDO1CYP11B1
SCHEMBL28842004 0.83 LTA4H (0.53) LTA4HALDH1A1CYP2D6ATMLMNA
SCHEMBL9341169 0.80 LTA4H (0.50) LTA4HALDH1A1CYP2D6ATMLMNA
SCHEMBL28872975 0.80 LTA4H (0.57) LTA4HALDH1A1CYP2D6ATMLMNA
SCHEMBL4250559 0.78 CALM1 (0.44) CYP2D6SMN1; SMN2
SCHEMBL28251912 0.78 LTA4H (0.72) LTA4HSMN1; SMN2MAOBIDO1SLC6A4
SCHEMBL28131751 0.77 LTA4H (0.64) LTA4HALDH1A1ATMSMN1; SMN2MAOB
SCHEMBL28748801 0.76 LTA4H (0.59) LTA4HALDH1A1SIGMAR1
SCHEMBL2027109 0.76 LTA4H (0.69) LTA4HSMN1; SMN2MAOBIDO1SLC6A4
SCHEMBL29080235 0.75 LTA4H (0.45) LTA4HALDH1A1CYP2D6ATMLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1666535-B1 RESIN COMPOSITION AND COMPOSITE USING THE COMPOSITION AND PRODUCTION PROCESS THEREOF DAICEL EVONIK LTD (JP) 2015-11-04 EP disclosed
US-8461248-B2 Resin composition and molded product thereof, and method for their production SONY CORPORATION (JP) 2013-06-11 US disclosed
EP-1674526-B9 POLYACETAL RESIN COMPOSITION POLYPLASTICS CO (JP) 2013-05-29 EP disclosed
EP-1674526-B1 POLYACETAL RESIN COMPOSITION POLYPLASTICS CO (JP) 2012-12-05 EP disclosed
EP-2230275-B1 Resin composition and molded product thereof, and method for their production SONY CORP (JP) 2012-11-21 EP disclosed
EP-1679346-B1 POLYACETAL RESIN COMPOSITION POLYPLASTICS CO (JP) 2012-11-14 EP disclosed
EP-2258761-B1 Polyester molding for use with a casing SONY CORP (JP) 2012-01-25 EP disclosed
US-8029910-B2 Resin composition and composite using the composition and production process thereof DAICEL-EVONIK LTD. (JP) 2011-10-04 US disclosed
US-7989540-B2 Resin composition and composite using the composition and production process thereof DAICEL-EVONIK LTD. (JP) 2011-08-02 US disclosed
EP-2258761-A1 Polyester molding for use with a casing Sony Corporation (JP) 2010-12-08 EP disclosed
EP-1502928-A1 MOLDED POLYESTER FOR HOUSING Sony Corporation (JP) 2005-02-02 EP disclosed
EP-1498460-A1 BIODEGRADABLE FLAME RETARDANT COMPOSITE COMPOSITION AND PROCESS FOR PRODUCING THE SAME Sony Corporation (JP) 2005-01-19 EP disclosed
US-6753363-B1 BASIC NITROGEN-CONTAINING COMPOUND, PHOSPHORUS COMPOUND FLAME RETARDANT, AND AROMATIC COMPOUND ACCELERATOR; MOLDABILITY POLYPLASTICS CO., LTD. (JP) 2004-06-22 US disclosed
US-6673405-B2 HINDERED PHENOL-SERIES COMPOUND, A WEATHER (LIGHT)-RESISTANT STABILIZER, AND A SPIRO-COMPOUND HAVING A TRIAZINE RING, PARTICULARLY A BIS(GUANAMINOHYDROCARBYL)-2,4,8,10-TETRAOXASPIRO(5.5)UNDECANE POLYPLASTICS CO., LTD. (JP) 2004-01-06 US disclosed
EP-1375597-A1 RADIATION-SENSITIVE COMPOSITION CHANGING IN REFRACTIVE INDEX AND UTILIZATION THEREOF JSR Corporation (JP) 2004-01-02 EP disclosed
US-20030171468-A1 Radiation-sensitive composition changing in refractive index and utilization thereof JSR CORPORATION (JP) 2003-09-11 US disclosed
US-20030036591-A1 Polyacetal resin composition and process for its production POLYPLASTICS CO., LTD. (JP) 2003-02-20 US disclosed
US-20030018099-A1 Polyester molding for use with a casing Lerner, David, Littenberg, Krumholz & Mentlik, LLP 2003-01-23 US disclosed
EP-1275690-A2 Polyester molding for use with a casing SONY CORPORATION (JP) 2003-01-15 EP disclosed
EP-1264858-A1 POLYACETAL RESIN COMPOSITION AND PROCESS FOR ITS PRODUCTION Polyplastics Co Ltd (JP) 2002-12-11 EP disclosed