SCHEMBL383087

SCHEMBL383087

CCc1cc(C2(c3ccc(O)c(CC)c3)c3ccccc3-c3ccccc32)ccc1O

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 4/20 0.64
ESR2 Q92731 4/20 0.64
MEN1 O00255 4/20 0.43
KMT2A Q03164 4/20 0.43
LMNA P02545 3/20 0.43
MAPT P10636 3/20 0.43
SMN1; SMN2 Q16637 2/20 0.43
KDM4E B2RXH2 1/20 0.43
OPRK1 P41145 1/20 0.43
POLB P06746 2/20 0.41
XBP1 P17861 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
BACE1 P56817 1/20 0.39
CYP2D6 P10635 1/20 0.38
HSD17B1 P14061 2/20 0.37
HSP90AA1 P07900 1/20 0.37
HSP90AB1 P08238 1/20 0.37
PDK2 Q15119 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29587240 1.00 ESR1 (0.64) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL22580542 0.94 ESR1 (0.57) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL19334604 0.93 ESR1 (0.56) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL13592688 0.93 ESR1 (0.78) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL13080601 0.90 ESR1 (0.52) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL18541606 0.89 ESR1 (0.52) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL18348575 0.89 ESR1 (0.52) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL17192496 0.89 ESR1 (0.52) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL29842572 0.88 ESR1 (0.60) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL383400 0.88 ESR1 (0.60) ESR1ESR2MEN1KMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 298 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12637540-B2 Resin produced by polycondensation, and resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-05-26 US disclosed
EP-4296295-B1 RESIN COMPOSITION, AND PRINTING INK AND ELECTROCONDUCTIVE PASTE EACH USING SAME MITSUBISHI GAS CHEMICAL CO (JP) 2026-05-06 EP disclosed
EP-2371877-B1 POLYCARBONATE RESIN, POLYCARBONATE RESIN COMPOSITION, OPTICAL FILM, AND POLYCARBONATE RESIN MOLDED ARTICLE MITSUBISHI CHEM CORP (JP) 2026-04-29 EP disclosed
EP-4242265-B1 RESIN COMPOSITION, COATING FILM USING SAME, AND ELECTROLYTE MITSUBISHI GAS CHEMICAL CO (JP) 2026-04-22 EP disclosed
US-20260098129-A1 THERMOPLASTIC RESIN AND MOLDED BODY CONTAINING THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-04-09 US disclosed
EP-4714991-A1 RESIN COMPOSITION, RESIN SOLUTION, AND METHOD FOR PRODUCING CROSSLINKED COATING FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-25 EP disclosed
EP-4714653-A1 MULTILAYER BODY AND CURED PRODUCT OBTAINED BY CURING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-25 EP disclosed
US-20260071030-A1 THERMOPLASTIC RESIN, MOLDED BODY CONTAINING THERMOPLASTIC RESIN, AND OPTICAL LENS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-12 US disclosed
EP-3909744-B1 ANTIREFLECTION FILM AND MULTILAYER FILM HAVING ANTIREFLECTION FILM MITSUBISHI GAS CHEMICAL CO (JP) 2026-03-11 EP disclosed
US-20260062520-A1 THERMOPLASTIC RESIN AND MOLDED OBJECT INCLUDING THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-05 US disclosed
US-5196296-A Resists for printed circuits NIPPON STEEL CORPORATION (JP) 1993-03-23 US disclosed
EP-0529812-A1 Thermally-responsive record material APPLETON PAPERS INC. (US) 1993-03-03 EP disclosed
US-5073595-A Fluorene chain extender; improved glass transition temperature toughness MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1991-12-17 US disclosed
US-5049169-A Oxygen, nitrogen selectivity NIPPON STEEL CORPORATION (JP) 1991-09-17 US disclosed
EP-0421086-A2 Epoxy acrylate resins and photosensitive resin compositions therefrom NIPPON STEEL CORPORATION (JP) 1991-04-10 EP disclosed
US-4983672-A Containing 9,9-bis(hydroxyphenyl)fluorene MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1991-01-08 US disclosed
US-4980234-A CONTAINING SUBSTITUTED FLUORENE UNITS MINNESOTA MINING AND MANUFACTURING CO. (US) 1990-12-25 US disclosed
US-4925913-A HYDROXYPHENYL FLUORENE MONOMER, PHOTOSENSITIVITY NIPPON STEEL CORPORATION (JP) 1990-05-15 US disclosed
EP-0325058-A1 Improved epoxide resin compositions and method MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1989-07-26 EP disclosed
US-4810771-A MOLDING MATERIALS NIPPON STEEL CORPORATION (JP) 1989-03-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260062520-A1 THERMOPLASTIC RESIN AND MOLDED OBJECT INCLUDING THERMOPLASTIC RESIN RER1, PUF60, SEM1 ESR1 1106/4885ESR2 871/4885MEN1 1038/4885
US-20260071030-A1 THERMOPLASTIC RESIN, MOLDED BODY CONTAINING THERMOPLASTIC RESIN, AND OPTICAL LENS DERL1, WDR1, RIF1 ESR1 2721/4885ESR2 2293/4885MEN1 518/4885
US-12637540-B2 Resin produced by polycondensation, and resin composition TAF1, TAF5, PUF60 ESR1 758/4885ESR2 520/4885MEN1 4749/4885
US-20260098129-A1 THERMOPLASTIC RESIN AND MOLDED BODY CONTAINING THERMOPLASTIC RESIN RER1, EIF2AK1, RIOK1 ESR1 2292/4885ESR2 1471/4885MEN1 1020/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.