SCHEMBL3831316

SCHEMBL3831316

C=C(CC1CCCCC1CC)C(=O)O

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA4 P22748 1/20 0.31
TET2 Q6N021 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3833714 0.81 EPHX1 (0.35) CA1CA2CA4TET2
SCHEMBL14401889 0.79 SLC6A12 (0.46) CA1CA2CA4
Bicarbonate SCHEMBL11401768 0.79 CA1 (0.41) CA1CA2CA4
SCHEMBL6824532 0.78 CA1 (0.41) CA1CA2CA4
SCHEMBL6917339 0.77
SCHEMBL4927596 0.76 TET2 (0.30) TET2
SCHEMBL21974894 0.75 CA1 (0.35) CA1CA2CA4
SCHEMBL1712935 0.74 CYP1A2 (0.36)
SCHEMBL12654696 0.74 ALDH1A1 (0.39)
SCHEMBL6724940 0.73 EPHX1 (0.31) CA1CA2CA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1833917-B1 SILICONE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED RESIN DOW CORNING TORAY CO LTD (JP) 2009-09-30 EP disclosed
US-20080319144-A1 Silicone Resin Composition, Curable Resin Composition, and Cured Resin DOW CORNING TORAY CO., LTD. (JP) 2008-12-25 US disclosed
EP-1833917-A1 SILICONE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED RESIN Dow Corning Toray Co., Ltd. (JP) 2007-09-19 EP disclosed
WO-2006073056-A1 SILICONE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED RESIN DOW CORNING TORAY CO., LTD. (JP) 2006-07-13 WO disclosed