Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.63 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.55 |
| ▸ | LTA4H | P09960 | 6/20 | 0.55 |
| ▸ | TSHR | P16473 | 1/20 | 0.55 |
| ▸ | MAPT | P10636 | 1/20 | 0.54 |
| ▸ | GRM5 | P41594 | 2/20 | 0.50 |
| ▸ | HAO1 | Q9UJM8 | 1/20 | 0.49 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.48 |
| ▸ | BAX | Q07812 | 1/20 | 0.48 |
| ▸ | MAOA | P21397 | 1/20 | 0.48 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.47 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.47 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.47 |
| ▸ | CHRNA7 | P36544 | 1/20 | 0.47 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.47 |
| ▸ | ACACB | O00763 | 1/20 | 0.45 |
| ▸ | PLA2G2A | P14555 | 1/20 | 0.45 |
| ▸ | CA12 | O43570 | 1/20 | 0.45 |
| ▸ | CA1 | P00915 | 1/20 | 0.45 |
| ▸ | CA2 | P00918 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6727043 | 0.97 | LTA4H (0.60) | APPFFAR1LTA4HTSHRMAPT | |
| SCHEMBL14380094 | 0.97 | LTA4H (0.60) | APPFFAR1LTA4HTSHRMAPT | |
| SCHEMBL6287635 | 0.95 | LTA4H (0.63) | APPFFAR1LTA4HTSHRMAPT | |
| SCHEMBL5414558 | 0.93 | APP (0.55) | APPFFAR1LTA4HTSHRMAPT | |
| SCHEMBL5406443 | 0.93 | APP (0.55) | APPFFAR1LTA4HTSHRMAPT | |
| SCHEMBL13283919 | 0.89 | LTA4H (0.68) | APPFFAR1LTA4HMAPTHAO1 | |
| SCHEMBL3085615 | 0.89 | FFAR1 (0.52) | APPFFAR1LTA4HTSHRMAPT | |
| SCHEMBL19704831 | 0.85 | APP (0.57) | APPFFAR1MAPTGRM5HAO1 | |
| SCHEMBL25135302 | 0.84 | MEN1 (0.59) | APPFFAR1LTA4HTSHRMAPT | |
| SCHEMBL13567253 | 0.84 | FFAR1 (0.56) | FFAR1HAO1ACACBPPARGPPARA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0889920-B1 | POLYPHENYLENE OLIGOMERS AND POLYMERS | DOW CHEMICAL CO (US) | 2002-02-13 | — | — | EP | claimed |
| US-5965679-A | BASED A BISCYCLOPENTADIENONE AND AN AROMATIC DIACETYLENE; CURING; LOW DIELECTRIC; INTEGRATED CIRCUITS; MICROELECTRONICS; PRINTED CIRCUITS | THE DOW CHEMICAL COMPANY (US) | 1999-10-12 | — | — | US | claimed |
| EP-0889920-A1 | POLYPHENYLENE OLIGOMERS AND POLYMERS | THE DOW CHEMICAL COMPANY (US) | 1999-01-13 | — | — | EP | claimed |
| WO-1998011149-A1 | POLYPHENYLENE OLIGOMERS AND POLYMERS | THE DOW CHEMICAL COMPANY (US) | 1998-03-19 | — | — | WO | claimed |
| US-20210296120-A1 | Method of filling high aspect ratio, small dimension gaps and formulations useful therein | FOSTER KENNETH L (US) | 2021-09-23 | — | — | US | disclosed |
| US-9255186-B2 | Thermosetting resins with enhanced cure characteristics containing organofunctional silane moieties | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) | 2016-02-09 | — | — | US | disclosed |
| US-9217064-B2 | Thermosetting resins with enhanced cure characteristics containing organofunctional silane moieties | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) | 2015-12-22 | — | — | US | disclosed |
| US-20150197606-A1 | THERMOSETTING RESINS WITH ENHANCED CURE CHARACTERISTICS CONTAINING ORGANOFUNCTIONAL SILANE MOIETIES | GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) | 2015-07-16 | — | — | US | disclosed |
| US-20140206812-A1 | THERMOSETTING RESINS WITH ENHANCED CURE CHARACTERISTICS CONTAINING ORGANOFUNCTIONAL SILANE MOIETIES | GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) | 2014-07-24 | — | — | US | disclosed |
| EP-1245638-B1 | Composition for insulating film formation | JSR CORP (JP) | 2009-01-14 | — | — | EP | disclosed |
| US-7442780-B2 | light fastness, wet and dry crock resistance, perspiration, dye-transfer staining and wash fastness | NORTH CAROLINA STATE UNIVERSITY (US) | 2008-10-28 | — | — | US | disclosed |
| EP-1188807-B1 | Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing | JSR CORP (JP) | 2007-10-17 | — | — | EP | disclosed |
| WO-2000040637-A1 | LOW DIELECTRIC CONSTANT POLYMERS HAVING GOOD ADHESION AND TOUGHNESS AND ARTICLES MADE WITH SUCH POLYMERS | THE DOW CHEMICAL COMPANY (US) | 2000-07-13 | — | — | WO | disclosed |
| US-5965679-A | BASED A BISCYCLOPENTADIENONE AND AN AROMATIC DIACETYLENE; CURING; LOW DIELECTRIC; INTEGRATED CIRCUITS; MICROELECTRONICS; PRINTED CIRCUITS | THE DOW CHEMICAL COMPANY (US) | 1999-10-12 | — | — | US | disclosed |
| EP-0889920-A1 | POLYPHENYLENE OLIGOMERS AND POLYMERS | THE DOW CHEMICAL COMPANY (US) | 1999-01-13 | — | — | EP | disclosed |
| WO-1998011149-A1 | POLYPHENYLENE OLIGOMERS AND POLYMERS | THE DOW CHEMICAL COMPANY (US) | 1998-03-19 | — | — | WO | disclosed |
| EP-0670856-A1 | THERMOSETTABLE COMPOSITION CONTAINING MESOGENIC MOIETIES | THE DOW CHEMICAL COMPANY (US) | 1995-09-13 | — | — | EP | disclosed |
| US-5374701-A | Crosslinkable polymers of high strength free of structural defects | HAY ALLAN S (CA) | 1994-12-20 | — | — | US | disclosed |
| WO-1994012556-A2 | THERMOSETTABLE COMPOSITION CONTAINING DISCOTIC MESOGENIC MOIETIES | THE DOW CHEMICAL COMPANY (US) | 1994-06-09 | — | — | WO | disclosed |
| US-5233046-A | DIARYLACETYLENES, ENAMINES AND ACETYLENIC POLYMERS AND THEIR PRODUCTION | HAY ALLAN S (CA) | 1993-08-03 | — | — | US | disclosed |