Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALOX5 | P09917 | 1/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.39 |
| ▸ | POLB | P06746 | 3/20 | 0.39 |
| ▸ | PKM | P14618 | 1/20 | 0.39 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.39 |
| ▸ | PTPN7 | P35236 | 1/20 | 0.39 |
| ▸ | BLM | P54132 | 1/20 | 0.39 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | TP53 | P04637 | 1/20 | 0.39 |
| ▸ | OPRM1 | P35372 | 2/20 | 0.38 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18878201 | 0.76 | ALOX5 (0.45) | ALOX5KMT2APOLBPKMPTPN1 | |
| SCHEMBL9918374 | 0.74 | OPRM1 (0.46) | ALOX5KMT2APOLBOPRM1SMN1; SMN2 | |
| SCHEMBL7098541 | 0.74 | TP53 (0.46) | ALOX5KMT2APOLBPKMPTPN1 | |
| SCHEMBL80874 | 0.74 | — | — | |
| SCHEMBL31584726 | 0.71 | ALOX5 (0.41) | ALOX5KMT2APOLBPKMPTPN1 | |
| SCHEMBL9923033 | 0.71 | OPRM1 (0.47) | KMT2APOLBOPRM1SMN1; SMN2ALDH1A1 | |
| SCHEMBL22838158 | 0.70 | ALOX5 (0.44) | ALOX5KMT2APOLBPKMPTPN1 | |
| SCHEMBL8806794 | 0.70 | ALOX5 (1.00) | ALOX5 | |
| SCHEMBL942463 | 0.70 | — | — | |
| SCHEMBL919847 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1810323-B1 | COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING | EKC TECHNOLOGY INC (US) | 2009-12-09 | — | — | EP | disclosed |
| US-7579308-B2 | Compositions and processes for photoresist stripping and residue removal in wafer level packaging | EKC/DUPONT ELECTRONICS TECHNOLOGIES (US) | 2009-08-25 | — | — | US | disclosed |
| US-7543592-B2 | Compositions and processes for photoresist stripping and residue removal in wafer level packaging | EKC TECHNOLOGY, INC. (US) | 2009-06-09 | — | — | US | disclosed |
| EP-1810323-A1 | COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING | EKC TECHNOLOGY, INC. (US) | 2007-07-25 | — | — | EP | disclosed |
| US-20060115970-A1 | Compositions and processes for photoresist stripping and residue removal in wafer level packaging | EKC TECHNOLOGY, INC. | 2006-06-01 | — | — | US | disclosed |
| WO-2006050323-A1 | COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING | EKC TECHNOLOGY, INC. (US) | 2006-05-11 | — | — | WO | disclosed |
| US-20060094613-A1 | Compositions and processes for photoresist stripping and residue removal in wafer level packaging | LEE WAI M | 2006-05-04 | — | — | US | disclosed |
| US-20050263743-A1 | Compositions and processes for photoresist stripping and residue removal in wafer level packaging | EKC TECHNOLOGY, INC. | 2005-12-01 | — | — | US | disclosed |