⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2760480 | 0.77 | CTH (0.62) | — | |
| SCHEMBL18643312 | 0.72 | — | — | |
| SCHEMBL14820345 | 0.72 | CTH (0.50) | — | |
| SCHEMBL16936111 | 0.69 | — | — | |
| SCHEMBL13703376 | 0.65 | PANK3 (0.45) | — | |
| SCHEMBL16186179 | 0.65 | FFAR2 (0.56) | — | |
| SCHEMBL17791775 | 0.64 | CYP1A2 (0.31) | — | |
| SCHEMBL12037417 | 0.62 | — | — | |
| SCHEMBL9985471 | 0.59 | ALDH1A1 (0.62) | — | |
| SCHEMBL33146 | 0.57 | PDE4A (0.48) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1255797-B2 | METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES | OMG ELECTRONIC CHEMICALS INC (US) | 2016-10-12 | — | — | EP | claimed |
| EP-1255797-B1 | METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES | OMG ELECTRONIC CHEMICALS INC (US) | 2012-06-13 | — | — | EP | claimed |
| CN-1451031-A | Method for roughening copper surfaces for bonding to substrates | ELECTROCHEMICALS INC (US) | 2003-10-22 | — | — | CN | claimed |
| CN-111936496-B | Heterocyclic compounds useful as medicaments | 马萨里克大学 | 2023-12-29 | — | — | CN | disclosed |
| WO-2023227696-A1 | NEW DERIVATIVES FOR TREATING TRPM3 MEDIATED DISORDERS | KATHOLIEKE UNIVERSITEIT LEUVEN (BE) | 2023-11-30 | — | — | WO | disclosed |
| WO-2022126275-A1 | RADIOLABELED COMPOUNDS TARGETING THE PROSTATE-SPECIFIC MEMBRANE ANTIGEN | THE UNIVERSITY OF BRITISH COLUMBIA (CA) | 2022-06-23 | — | — | WO | disclosed |
| WO-2022119928-A1 | IMIDAZOLE COMPOUNDS AS INHIBITORS OF ENPP1 | Stingray Therapeutics, Inc. (US) | 2022-06-09 | — | — | WO | disclosed |
| WO-2021236885-A1 | PIPERIDINE-2,6-DIONES AS SMALL MOLECULE DEGRADERS OF HELIOS AND METHODS OF USE | DANA-FARBER CANCER INSTITUTE, INC. (US) | 2021-11-25 | — | — | WO | disclosed |
| WO-2021034548-A1 | MITOCHONDRIAL MODULATION TO IMPROVE METABOLIC SYNDROME DURING AGING | THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (US) | 2021-02-25 | — | — | WO | disclosed |
| CN-111936496-A | Use of 4- (1H-imidazol-5-yl) -1H-pyrrolo [2,3-B ] pyridine for the treatment of leukemias, lymphomas and solid tumors | 马萨里克大学 | 2020-11-13 | — | — | CN | disclosed |
| US-9920017-B2 | Heterocyclic compounds as pesticides | BAYER CROPSCIENCE AKTIENGESELLSCHAFT (DE) | 2018-03-20 | — | — | US | disclosed |
| US-20040159264-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2004-08-19 | — | — | US | disclosed |
| US-6774212-B2 | FOR THERAPY OF VIRAL INFECTION OR AS AN ASSAY STANDARD OR REAGENT | BRISTOL-MYERS SQUIBB PHARMA COMPANY | 2004-08-10 | — | — | US | disclosed |
| US-6716281-B2 | ADHESION PROMOTER COMPREISING OXIDIZER, PH ADJUSTER, TOPOGRAPHY MODIFIER; AND COATING STABILIZER COMPRISING 2-MERCAPTOTHIAZOLINE OR 2-MERCAPTOIMIDAZOLINE DERIVATIVE | ELECTROCHEMICALS, INC. | 2004-04-06 | — | — | US | disclosed |
| US-20040048486-A1 | Method for roughening copper surfaces for bonding to substrates | BERNARDS ROGER (US) | 2004-03-11 | — | — | US | disclosed |
| US-20030213553-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2003-11-20 | — | — | US | disclosed |
| CN-1451031-A | Method for roughening copper surfaces for bonding to substrates | ELECTROCHEMICALS INC (US) | 2003-10-22 | — | — | CN | disclosed |
| EP-1255797-A1 | METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES | ELECTROCHEMICALS INC. (US) | 2002-11-13 | — | — | EP | disclosed |
| US-20020084441-A1 | Method for roughening copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2002-07-04 | — | — | US | disclosed |
| WO-2001049805-A1 | METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES | ELECTROCHEMICALS INC. (US) | 2001-07-12 | — | — | WO | disclosed |