SCHEMBL3864602

SCHEMBL3864602

C=C(Cc1cc(C)c(O)c(C)c1)C(N)=O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HMGB1 P09429 1/20 0.41
CXCL12 P48061 1/20 0.41
PTGS1 P23219 3/20 0.37
PTGS2 P35354 3/20 0.37
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37
CYP1A2 P05177 1/20 0.35
CYP3A4 P08684 1/20 0.35
CYP2D6 P10635 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2B6 P20813 1/20 0.35
SHBG P04278 1/20 0.35
MAOA P21397 1/20 0.35
MAOB P27338 1/20 0.35
CISD1 Q9NZ45 1/20 0.35
ESR1 P03372 3/20 0.34
ESR2 Q92731 1/20 0.34
MEN1 O00255 4/20 0.33
KMT2A Q03164 4/20 0.33
KDM4E B2RXH2 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31186745 0.80 CA2 (0.48) HMGB1CXCL12PTGS1PTGS2CA1
SCHEMBL5422547 0.77 GAA (0.49) CA1CA2CYP1A2CYP3A4CYP2D6
SCHEMBL11519192 0.76 HMGB1 (0.46) HMGB1CXCL12PTGS1PTGS2CA1
SCHEMBL2921654 0.74 HMGB1 (0.52) HMGB1CXCL12PTGS1PTGS2CA1
SCHEMBL9405316 0.74 CA1 (0.44) HMGB1CXCL12PTGS1PTGS2CA1
SCHEMBL10880029 0.73 CTBP2 (0.46) CA2KMT2ANPC1HPGDLMNA
SCHEMBL28057947 0.73 MAPK8 (0.42) CA1MAOBMEN1KMT2A
SCHEMBL2152056 0.72 ALDH1A1 (0.37) CYP1A2CYP3A4MEN1KMT2AMAPT
SCHEMBL3873211 0.71 CA2 (0.63) CA2SHBGESR1ESR2KDM4E
SCHEMBL24325644 0.71 LMNA (0.47) HMGB1CXCL12PTGS1PTGS2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105566565-A Hydrophobic association polymer with double bonds on side chains, method for preparing hydrophobic association polymer and application thereof OCEAN UNIV CHINA 2016-05-11 CN claimed
CN-119816783-A Positive photosensitive resin composition 日保丽公司 2025-04-11 CN disclosed
CN-119781249-A Positive photosensitive resin composition, organic EL element barrier wall, organic EL element insulating film, and organic EL element 日保丽公司 2025-04-08 CN disclosed
CN-113939767-B Positive photosensitive resin composition and organic EL element partition wall 日保丽公司 2024-06-25 CN disclosed
CN-111538209-B Photosensitive resin composition, organic EL element partition wall, and organic EL element 日保丽公司 2024-05-14 CN disclosed
CN-117882008-A Positive photosensitive resin composition 日保丽公司 2024-04-12 CN disclosed
CN-117480451-A Positive photosensitive resin composition and organic EL element partition wall 日保丽公司 2024-01-30 CN disclosed
CN-116940897-A Photosensitive resin composition and organic EL element partition wall 株式会社力森诺科 2023-10-24 CN disclosed
CN-112888748-B Resin composition, cured film, printed wiring board with cured film, and method for producing same 株式会社钟化 2023-09-22 CN disclosed
CN-114096568-B Composition, cured product, method for producing cured product, and additive 株式会社艾迪科 2023-08-18 CN disclosed
US-7482111-B2 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2009-01-27 US disclosed
EP-1826612-A1 Radiation-sensitive positive resin composition for producing platings, transfer film, and process for producing platings JSR Corporation (JP) 2007-08-29 EP disclosed
US-20070196765-A1 RADIATION-SENSITIVE POSITIVE RESIN COMPOSITION FOR PRODUCING PLATINGS, TRANSFER FILM, AND PROCESS FOR PRODUCING PLATINGS JSR CORPORATION (JP) 2007-08-23 US disclosed
US-20070190450-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2007-08-16 US disclosed
US-20070190465-A1 Positively radiation-sensitive resin composition JSR CORPORATION (JP) 2007-08-16 US disclosed
CN-1934497-A Negative radiation-sensitive resin composition JSR CORP (JP) 2007-03-21 CN disclosed
CN-1908816-A Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material JSR CORP (JP) 2007-02-07 CN disclosed
EP-1746461-A1 NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2007-01-24 EP disclosed
EP-1729176-A1 POSITIVELY RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2006-12-06 EP disclosed
US-4131644-A TREATING POLYBUTADIENE WITH A LEWIS ACID AND A SULFUR MELT, CARBONIZING UBE INDUSTRIES, INC. (JP) 1978-12-26 US disclosed