SCHEMBL3874718

SCHEMBL3874718

CCCCCCCC(C(F)(F)F)(C(F)(F)F)S(=O)(=O)O

nearest known ligand 0.46

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CES2 O00748 4/20 0.46
LPAR1 Q92633 1/20 0.46
LPAR3 Q9UBY5 1/20 0.46
CES1 P23141 9/20 0.44
EPHX1 P07099 2/20 0.44
FAAH O00519 9/20 0.41
MEN1 O00255 1/20 0.39
CYP1A2 P05177 1/20 0.39
KMT2A Q03164 1/20 0.39
HSD17B10 Q99714 1/20 0.39
GGPS1 O95749 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3874301 0.83 CES1 (0.33) CES1EPHX1
SCHEMBL679295 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL31249509 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL28629893 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL17773374 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL3871219 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL18008423 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL18008469 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL18008526 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1
SCHEMBL28625404 0.79 CES2 (0.48) CES2LPAR1LPAR3CES1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7638261-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-12-29 US disclosed
US-20090148790-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2009-06-11 US disclosed
US-7521169-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-04-21 US disclosed
US-20080187859-A1 Radiation-Sensitive Resin Composition JSR CORPORATION (JP) 2008-08-07 US disclosed
US-7297461-B2 Radiation sensitive resin composition JSR CORPORATION (JP) 2007-11-20 US disclosed
US-7288359-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-10-30 US disclosed
EP-1736829-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2006-12-27 EP disclosed
US-20060234153-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-10-19 US disclosed
US-7108955-B2 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2006-09-19 US disclosed
US-20050171226-A1 Radiation sensitive resin composition JSR CORPORATION (JP) 2005-08-04 US disclosed
EP-1557718-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2005-07-27 EP disclosed
US-20040143082-A1 Polysiloxane, process for production thereof and radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed
EP-1398339-A1 POLYSILOXANE, PROCESS FOR PRODUCTION THEREOF AND RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-03-17 EP disclosed
US-20030219680-A1 Photoresists useful for microfabrication utilizing deep ultraviolet rays such as an excimer laser, x-rays such as synchrotron radiation, and electron beams JSR CORPORATION (JP) 2003-11-27 US disclosed
US-20030170561-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2003-09-11 US disclosed