Magnesium

Magnesium

SCHEMBL3899343

Cl[Si](Cl)(Cl)Cl.[Mg]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5442827 0.89 ALDH1A1 (0.43)
SCHEMBL20461 0.89
SCHEMBL8581776 0.80
SCHEMBL1663390 0.80
SCHEMBL10348508 0.80
SCHEMBL1415964 0.80
SCHEMBL17393533 0.80
Water SCHEMBL6694512 0.80
SCHEMBL11353006 0.80
Charcoal, Activated SCHEMBL6544903 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115907464-A Silicon sand carbon footprint analysis method and system for crystalline silicon photovoltaic component raw material 浙江正泰智维能源服务有限公司 2023-04-04 CN disclosed
CN-101007725-B Water-resistant chlorine oxygen magnesium silicon series composite material and its preparing process NANJING SHANGBO TECHNOLOGY INDUSTRY CO LTD 2010-05-19 CN disclosed
US-7553775-B2 Method for coating semiconductor surface, process for production of semiconductor particles using said method, and optical element using said semiconductor particles KABUSHIKI KAISHA TOSHIBA (JP) 2009-06-30 US disclosed
CN-101007725-A Water-resistant chlorine oxygen magnesium silicon series composite material and its preparing process WANG HUILING (CN) 2007-08-01 CN disclosed
US-20060046447-A1 Method for coating semiconductor surface, process for production of semiconductor particles using said method, and optical element using said semiconductor particles KABUSHIKI KAISHA TOSHIBA (JP) 2006-03-02 US disclosed