SCHEMBL392038

SCHEMBL392038

C=C(C)C(=O)Oc1c(OCCC)cc(C(C)(C)c2cc(OCCC)c(OC(=O)C(=C)C)c(OCCC)c2OCCC)c(OCCC)c1OCCC

nearest known ligand 0.34

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
SMN1; SMN2 Q16637 3/20 0.32
ALDH1A1 P00352 1/20 0.32
RARG P13631 2/20 0.32
RXRA P19793 2/20 0.32
PPARG P37231 2/20 0.32
MAPT P10636 2/20 0.32
HSD17B10 Q99714 1/20 0.32
TSHR P16473 2/20 0.31
CA9 Q16790 1/20 0.31
RAB9A P51151 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30
PTAFR P25105 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6472692 0.94 TSHR (0.36) KMT2ASMN1; SMN2ALDH1A1RXRAPPARG
SCHEMBL6386501 0.93 MAPT (0.33) MEN1KMT2ASMN1; SMN2RARGRXRA
SCHEMBL29771328 0.88 MEN1 (0.36) MEN1KMT2AALDH1A1MAPTTSHR
SCHEMBL29114642 0.88 MEN1 (0.36) MEN1KMT2AALDH1A1MAPTTSHR
SCHEMBL65695 0.88 MEN1 (0.36) MEN1KMT2AALDH1A1MAPTTSHR
SCHEMBL305556 0.87 TSHR (0.40) MEN1KMT2ASMN1; SMN2ALDH1A1TSHR
SCHEMBL23149337 0.84 MEN1 (0.33) MEN1KMT2A
SCHEMBL15158116 0.82 TSHR (0.37) MEN1KMT2ASMN1; SMN2ALDH1A1MAPT
SCHEMBL11136817 0.82 THRB (0.37) MEN1KMT2ASMN1; SMN2ALDH1A1RARG
SCHEMBL27125372 0.82 CA9 (0.34) MEN1KMT2ASMN1; SMN2ALDH1A1RARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2565037-B1 Process for producing flexographic printing plate precursor for laser engraving, and process for making flexographic printing plate FUJIFILM CORP (JP) 2014-10-01 EP disclosed
EP-2284611-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD HITACHI CHEMICAL CO LTD (JP) 2013-11-20 EP disclosed
EP-2492093-B1 Relief printing plate precursor for laser engraving and process for producing a relief printing plate FUJIFILM CORP (JP) 2013-08-28 EP disclosed
US-8501392-B2 Photosensitive element, method for formation of resist pattern, and method for production of print circuit board HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-08-06 US disclosed
US-8460853-B2 Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-06-11 US disclosed
US-8460852-B2 Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-06-11 US disclosed
EP-2565037-A1 Process for producing flexographic printing plate precursor for laser engraving, and process for making flexographic printing plate Fujifilm Corporation (JP) 2013-03-06 EP disclosed
US-8389204-B2 Method for producing comb-shaped electrode TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-05 US disclosed
US-20130049264-A1 PROCESS FOR PRODUCING FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR MAKING FLEXOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2013-02-28 US disclosed
EP-2492093-A2 Relief printing plate precursor for laser engraving and process for producing same, and relief printing plate and process for making same Fujifilm Corporation (JP) 2012-08-29 EP disclosed
US-20060051698-A1 Photosensitive resin composition and photosensitive element employing using the same MIYOSHI HIROKO 2006-03-09 US disclosed
EP-1569213-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME Hitachi Chemical Co., Ltd. (JP) 2005-08-31 EP disclosed
WO-2005016983-A1 COATING SYSTEM CONTAINING (METH)ACRYLATE SIKA TECHNOLOGY AG (CH) 2005-02-24 WO disclosed
US-20040112859-A1 Photosensitive film for circuit formation and process for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2004-06-17 US disclosed
EP-0769038-B1 SYNTHETIC MORTAR RESIN COMPOSITIONS CRAY VALLEY SA (FR) 1998-03-04 EP disclosed
US-5300536-A Vinyl compound capable of free radical polymerization TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1994-04-05 US disclosed
US-4394494-A DIURETHANE TETRAACRYLATES AS POLYMERIZABLE MONOMERS LION CORPORATION (JP) 1983-07-19 US disclosed
US-4388421-A PRIMERS LION CORPORATION (JP) 1983-06-14 US disclosed
US-4383052-A 1-Methacryloxyethane-1,1-diphosphonic acid and its salts and dental adhesive composition containing same LION CORPORATION (JP) 1983-05-10 US disclosed
US-4055542-A PEROXIDE THREE BOND CO., LTD. (JA) 1977-10-25 US disclosed