Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 4/20 | 0.52 |
| ▸ | SKP2 | Q13309 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.42 |
| ▸ | GAA | P10253 | 4/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.41 |
| ▸ | POLB | P06746 | 2/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.41 |
| ▸ | MAPT | P10636 | 2/20 | 0.41 |
| ▸ | ESR1 | P03372 | 1/20 | 0.41 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | RAB9A | P51151 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | THRA | P10827 | 3/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | GFER | P55789 | 1/20 | 0.39 |
| ▸ | CDC25B | P30305 | 1/20 | 0.37 |
| ▸ | CASP6 | P55212 | 1/20 | 0.37 |
| ▸ | RCE1 | Q9Y256 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29942793 | 0.91 | THRB (0.51) | THRBALDH1A1GAACYP3A4POLB | |
| SCHEMBL100769 | 0.91 | THRB (0.51) | THRBALDH1A1GAACYP3A4POLB | |
| SCHEMBL31079561 | 0.84 | SKP2 (0.61) | THRBSKP2ALDH1A1GAACYP3A4 | |
| SCHEMBL237201 | 0.84 | SKP2 (0.61) | THRBSKP2ALDH1A1GAACYP3A4 | |
| SCHEMBL10942694 | 0.84 | ALDH1A1 (0.52) | THRBALDH1A1GAACYP3A4POLB | |
| SCHEMBL3943098 | 0.84 | THRB (0.47) | THRBALDH1A1GAACYP3A4POLB | |
| SCHEMBL3482071 | 0.82 | SKP2 (0.59) | SKP2ALDH1A1GAACYP3A4POLB | |
| Hydrochloric Acid SCHEMBL8644397 | 0.82 | SKP2 (0.59) | SKP2ALDH1A1GAACYP3A4POLB | |
| Ammonia Solution, Strong SCHEMBL22344976 | 0.82 | SKP2 (0.59) | THRBSKP2ALDH1A1GAACYP3A4 | |
| Hydrochloric Acid SCHEMBL2929105 | 0.82 | SKP2 (0.59) | SKP2ALDH1A1GAACYP3A4POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | claimed |
| US-9957425-B2 | Adhesive composition for semiconductor and adhesive film including the same | CHEIL INDUSTRIES, INC. (KR) | 2018-05-01 | — | — | US | disclosed |
| US-9169425-B2 | Adhesive film and electronic device including the same | CHEIL INDUSTRIES, INC. (KR) | 2015-10-27 | — | — | US | disclosed |
| US-9109147-B2 | Adhesive composition for semiconductor and adhesive film comprising the same | CHEIL INDUSTRIES, INC. (KR) | 2015-08-18 | — | — | US | disclosed |
| US-8946343-B2 | Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film | CHEIL INDUSTRIES, INC. (KR) | 2015-02-03 | — | — | US | disclosed |
| US-20140194555-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2014-07-10 | — | — | US | disclosed |
| US-20140186607-A1 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM | CHEIL INDUSTRIES, INC. (KR) | 2014-07-03 | — | — | US | disclosed |
| US-20130281559-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2013-10-24 | — | — | US | disclosed |
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | disclosed |
| US-20130154125-A1 | ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME | CHEIL INDUSTRIES INC. (KR) | 2013-06-20 | — | — | US | disclosed |
| US-20010015484-A1 | Heat -resistant adhesive sheet | MATSUURA HIDEKAZU (JP) | 2001-08-23 | — | — | US | disclosed |
| US-6248613-B1 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-06-19 | — | — | US | disclosed |
| US-6046072-A | BONDING A SEMICONDUCTOR CHIP TO A LEAD FRAME WITH ADHESIVE MEMBER HAVING LOW MOISTURE ABSORBING, LOW FLOW ADHESIVE AND ENCAPSULATING PACKAGE WITH SEALANT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-04-04 | — | — | US | disclosed |
| EP-0618614-B1 | Heat-resistant adhesive for the fabrication of a semiconductor package | HITACHI CHEMICAL CO LTD (JP) | 1999-01-07 | — | — | EP | disclosed |
| EP-0862205-A1 | Heat-resistant adhesive | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-02 | — | — | EP | disclosed |
| EP-0553612-B1 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO LTD (JP) | 1996-08-21 | — | — | EP | disclosed |
| US-5510425-A | AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-23 | — | — | US | disclosed |
| US-5508357-A | SOLUBILITY IN SOLVENT, LOW MELTING POINT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-16 | — | — | US | disclosed |
| EP-0618614-A2 | Heat-resistant adhesive for the fabrication of a semiconductor package | Hitachi Chemical Co., Ltd. (JP) | 1994-10-05 | — | — | EP | disclosed |
| EP-0553612-A2 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO., LTD. (JP) | 1993-08-04 | — | — | EP | disclosed |