SCHEMBL394135

SCHEMBL394135

Cc1ccc(CO)c(CO)c1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.48
KDM4E B2RXH2 2/20 0.48
HPGD P15428 2/20 0.48
HSD17B10 Q99714 1/20 0.48
SHBG P04278 1/20 0.41
PDXK O00764 2/20 0.39
LMNA P02545 2/20 0.36
TRPA1 O75762 1/20 0.34
HTR1D P28221 1/20 0.34
HTR1B P28222 1/20 0.34
CYP1A2 P05177 1/20 0.33
CYP2D6 P10635 1/20 0.33
CYP2C19 P33261 1/20 0.33
HIF1A Q16665 1/20 0.33
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
AOX1 Q06278 1/20 0.32
PDCD1 Q15116 1/20 0.31
CD274 Q9NZQ7 1/20 0.31
KLF10 Q13118 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13386079 0.85 LMNA (0.53) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL8346909 0.83 ALDH1A1 (0.43) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL9861974 0.82 ALDH1A1 (0.44) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL4729851 0.81 KDM4E (0.38) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL10912412 0.80 KDM4E (0.45) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL29493008 0.80 KDM4E (0.45) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL205613 0.79 PDCD1 (0.36) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL29624183 0.79 PDCD1 (0.36) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL11038751 0.76 KDM4E (0.42) ALDH1A1KDM4EHPGDHSD17B10SHBG
SCHEMBL2266269 0.75 GABRA1 (0.43) ALDH1A1KDM4EHPGDHSD17B10SHBG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 307 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5597876-A CURING AGENT PROVIDES BETTER MECHANICAL PROPERTIES AT HIGH TEMPERATURE SHELL OIL COMPANY (US) 1997-01-28 US claimed
EP-0273026-A2 Solvents for Photoresist compositions SHIPLEY COMPANY INC. (US) 1988-06-29 EP claimed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
EP-4398289-B1 CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID FUJIFILM CORP (JP) 2025-07-02 EP disclosed
WO-2025094716-A1 RESIN COMPOSITION 富士フイルム株式会社 2025-05-08 WO disclosed
WO-2025070302-A1 RESIN COMPOSITION AND METHOD FOR PRODUCING INTERLAYER INSULATING FILM FOR REDISTRIBUTION LAYER 富士フイルム株式会社 2025-04-03 WO disclosed
EP-0377308-A1 Phenolic resins BORDEN (UK) LIMITED (GB) 1990-07-11 EP disclosed
WO-1990006903-A1 PHENOLIC RESINS BORDEN (UK) LIMITED (GB) 1990-06-28 WO disclosed
WO-1990006904-A2 PHENOLIC RESINS BORDEN (UK) LIMITED (GB) 1990-06-28 WO disclosed
EP-0345714-A2 Dyed photoresist compositions and process ASPECT SYSTEMS CORPORATION (US) 1989-12-13 EP disclosed
EP-0273026-A2 Solvents for Photoresist compositions SHIPLEY COMPANY INC. (US) 1988-06-29 EP disclosed
EP-0032062-B1 HIGH-MOLECULAR-WEIGHT NOVOLAK SUBSTITUTED PHENOLIC RESINS AND THEIR PREPARATION MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1985-04-03 EP disclosed
US-4469516-A Pigment preparations; process for their manufacture and their use HOECHST AKTIENGESELLSCHAFT (DE) 1984-09-04 US disclosed
US-4345054-A High-molecular-weight novolak types substituted phenolic resins and process for preparation thereof MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1982-08-17 US disclosed
EP-0032062-A2 High-molecular-weight novolak substituted phenolic resins and their preparation MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1981-07-15 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 ALDH1A1 3316/4885KDM4E 295/4885HPGD 3226/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.