Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 8/20 | 0.52 |
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.52 |
| ▸ | HPGD | P15428 | 2/20 | 0.52 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 5/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.50 |
| ▸ | PPM1B | O75688 | 1/20 | 0.49 |
| ▸ | IDO1 | P14902 | 1/20 | 0.47 |
| ▸ | APEX1 | P27695 | 2/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.45 |
| ▸ | GFER | P55789 | 1/20 | 0.45 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.45 |
| ▸ | MAPT | P10636 | 4/20 | 0.44 |
| ▸ | MCL1 | Q07820 | 3/20 | 0.44 |
| ▸ | MEN1 | O00255 | 3/20 | 0.44 |
| ▸ | THRB | P10828 | 3/20 | 0.44 |
| ▸ | RECQL | P46063 | 2/20 | 0.44 |
| ▸ | USP2 | O75604 | 1/20 | 0.44 |
| ▸ | POLB | P06746 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL297425 | 0.88 | ALDH1A1 (0.52) | KDM4EALDH1A1HPGDHSD17B10TDP1 | |
| SCHEMBL1557874 | 0.84 | MCL1 (0.59) | KDM4EALDH1A1HPGDHSD17B10TDP1 | |
| SCHEMBL1143102 | 0.83 | KDM4E (0.61) | KDM4EALDH1A1HPGDHSD17B10TDP1 | |
| SCHEMBL29404402 | 0.80 | KDM4E (0.64) | KDM4EALDH1A1HSD17B10TDP1CYP3A4 | |
| SCHEMBL261343 | 0.80 | KDM4E (0.64) | KDM4EALDH1A1HSD17B10TDP1CYP3A4 | |
| SCHEMBL29439092 | 0.80 | KDM4E (0.64) | KDM4EALDH1A1HSD17B10TDP1CYP3A4 | |
| SCHEMBL24616726 | 0.80 | LMNA (0.59) | KDM4EALDH1A1HPGDHSD17B10TDP1 | |
| SCHEMBL22336405 | 0.78 | APEX1 (0.67) | KDM4EALDH1A1HPGDHSD17B10TDP1 | |
| SCHEMBL2363013 | 0.78 | APEX1 (0.67) | KDM4EALDH1A1HPGDHSD17B10TDP1 | |
| SCHEMBL28680854 | 0.78 | KDM4E (0.62) | KDM4EALDH1A1HSD17B10TDP1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021028960-A1 | COLORED RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | 太陽ホールディングス株式会社 | 2021-02-18 | — | — | WO | disclosed |
| WO-2021029243-A1 | COLORED RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | 太陽ホールディングス株式会社 | 2021-02-18 | — | — | WO | disclosed |
| CN-102089711-B | Positive photosensitive resin composition and polyhydroxyamide resin | NISSAN CHEMICAL IND LTD | 2013-05-22 | — | — | CN | disclosed |
| CN-102089711-A | Positive photosensitive resin composition and polyhydroxyamide resin | NISSAN CHEMICAL IND LTD | 2011-06-08 | — | — | CN | disclosed |
| US-7560307-B2 | Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-07-14 | — | — | US | disclosed |
| CN-1286918-C | Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | HITACHI CHEMICAL CO LTD (JP) | 2006-11-29 | — | — | CN | disclosed |
| US-20060180908-A1 | Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same | YANO YASUHIRO | 2006-08-17 | — | — | US | disclosed |
| US-7061081-B2 | Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics | HITACHI CHEMICAL CO., LTD. (JP) | 2006-06-13 | — | — | US | disclosed |
| CN-1416452-A | Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | HITACHI CHEMICAL CO LTD (JP) | 2003-05-07 | — | — | CN | disclosed |
| US-20030082925-A1 | Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics | HITACHI CHEMICAL CO., LTD. (JP) | 2003-05-01 | — | — | US | disclosed |