Hydrochloric Acid

Hydrochloric Acid

SCHEMBL39637

Cc1ccc2sc(-c3ccc(N(C)C)cc3)[n+](Cc3ccccc3)c2c1.[Cl-]

nearest known ligand 0.59

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 3/20 0.59
SNCA P37840 2/20 0.59
BCHE P06276 1/20 0.59
TNF P01375 1/20 0.57
NOD1 Q9Y239 1/20 0.57
MEN1 O00255 2/20 0.56
KMT2A Q03164 2/20 0.56
NPC1 O15118 1/20 0.56
POLB P06746 1/20 0.56
RAB9A P51151 1/20 0.56
INSR P06213 10/20 0.53
GPR35 Q9HC97 1/20 0.40
GPR55 Q9Y2T6 1/20 0.40
KDM4E B2RXH2 2/20 0.39
CHKA P35790 3/20 0.39
ALDH1A1 P00352 3/20 0.39
LMNA P02545 2/20 0.39
HTT P42858 2/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
MAPT P10636 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19305175 0.99 APP (0.58) APPSNCABCHETNFNOD1
Hydrochloric Acid SCHEMBL19305188 0.91 APP (0.66) APPSNCABCHETNFNOD1
SCHEMBL19305179 0.89 INSR (0.66) APPSNCABCHETNFNOD1
Hydrochloric Acid SCHEMBL39306 0.89 APP (0.46) APPSNCABCHETNFNOD1
SCHEMBL19305174 0.87 APP (0.44) APPSNCABCHETNFNOD1
Hydrochloric Acid SCHEMBL40198 0.87 INSR (0.61) APPSNCABCHETNFNOD1
SCHEMBL19305173 0.85 INSR (0.62) APPSNCABCHETNFNOD1
Hydrochloric Acid SCHEMBL39068 0.84 INSR (0.47) APPSNCABCHETNFNOD1
SCHEMBL19305180 0.83 INSR (0.48) APPSNCABCHETNFNOD1
Hydrochloric Acid SCHEMBL39418 0.80 APP (0.80) APPSNCABCHETNFNOD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP claimed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US claimed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP claimed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP claimed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US claimed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US claimed
WO-2011147448-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2011-12-01 WO claimed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP claimed
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP disclosed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US disclosed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP disclosed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP disclosed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US disclosed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US disclosed
WO-2011147448-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2011-12-01 WO disclosed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP disclosed