SCHEMBL3977500

SCHEMBL3977500

CC(=O)C(C)(O)C#N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9277882 0.79
Dimethylketone Cyanohydrin SCHEMBL6474504 0.75 LMNA (0.40)
Dimethylketone Cyanohydrin SCHEMBL11460654 0.73 FFAR3 (0.44)
SCHEMBL10879561 0.73
SCHEMBL1343515 0.73
SCHEMBL8532795 0.73
SCHEMBL27626498 0.71 LMNA (0.33)
Dimethylketone Cyanohydrin SCHEMBL22127954 0.71 LMNA (0.35)
SCHEMBL12714423 0.71
Dimethylketone Cyanohydrin SCHEMBL5478951 0.69 ALDH1A1 (0.44)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4048418-A Method of polymerization of conjugated diolefins using iron catalysts and nitrogen ligands THE GOODYEAR TIRE & RUBBER COMPANY (US) 1977-09-13 US claimed
US-9746768-B2 Resist overlayer film forming composition for lithography and method for producing semiconductor device using the same NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-08-29 US disclosed
US-20150362835-A1 RESIST OVERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-12-17 US disclosed
WO-2009058274-A1 CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE EKC TECHNOLOGY, INC. (US) 2009-05-07 WO disclosed
WO-2009058278-A1 METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMPOSITIONS EKC TECHNOLOGY, INC (US) 2009-05-07 WO disclosed
WO-2009058272-A1 COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS EKC TECHNOLOGY, INC. (US) 2009-05-07 WO disclosed
WO-2009058275-A1 METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS EKC TECHNOLOGY, INC. (US) 2009-05-07 WO disclosed
US-4168244-A CONJUGATED DIOLEFINS TO HIGH MOLECULAR WEIGHT STEREOREGULAR POLYMERS THE GOODYEAR TIRE & RUBBER COMPANY (US) 1979-09-18 US disclosed
US-4048418-A Method of polymerization of conjugated diolefins using iron catalysts and nitrogen ligands THE GOODYEAR TIRE & RUBBER COMPANY (US) 1977-09-13 US disclosed