SCHEMBL39900

SCHEMBL39900

C=CC(=O)OC1(C)C2CC3CC(C2)CC1C3

nearest known ligand 0.40

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CYP17A1 P05093 2/20 0.40
CYP19A1 P11511 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid Methyl Ester SCHEMBL6303295 0.89 CYP17A1 (0.34) CYP17A1CYP19A1
Methacrylic Acid SCHEMBL6298832 0.85 CYP17A1 (0.33) CYP17A1CYP19A1
Maleic Anhydride SCHEMBL843362 0.85 CYP17A1 (0.38) CYP17A1CYP19A1
SCHEMBL7745860 0.85 CYP17A1 (0.41) CYP17A1CYP19A1
Methacrylic Acid SCHEMBL6303616 0.83 ALDH1A1 (0.39) CYP17A1CYP19A1
Methacrylic Acid SCHEMBL6298173 0.83 CYP17A1 (0.32) CYP17A1CYP19A1
SCHEMBL4742222 0.83 CYP17A1 (0.40) CYP17A1CYP19A1
SCHEMBL685522 0.83
SCHEMBL686055 0.82 CYP17A1 (0.42) CYP17A1CYP19A1
SCHEMBL14519225 0.82 HSD11B1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2462 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250388769-A1 Ink Composition, Package Structure and Semiconductor Device HANGZHOU FIRST APPLIED MAT CO LTD (CN) 2025-12-25 US claimed
EP-4530321-A1 INK COMPOSITION, PACKAGING STRUCTURE, AND SEMICONDUCTOR DEVICE Hangzhou First Applied Material Co., Ltd. (CN) 2025-04-02 EP claimed
CN-119148465-A Photosensitive resin composition, photosensitive dry film and application thereof 杭州福斯特电子材料有限公司 2024-12-17 CN claimed
CN-118930715-A Acrylic resin polymer and preparation method and application thereof 中国科学院宁波材料技术与工程研究所 2024-11-12 CN claimed
CN-118625599-A Photosensitive resin composition, photosensitive dry film and preparation method thereof 杭州福斯特电子材料有限公司 2024-09-10 CN claimed
CN-115160495-B Photoresist film-forming resin containing maleimide structure and preparation method thereof 四川华造宏材科技有限公司 2024-05-14 CN claimed
CN-114560768-B Synthesis method of acrylic resin monomer for 193nm photoresist 河北凯诺中星科技有限公司 2024-03-15 CN claimed
CN-117659263-A Weather-resistant room-temperature-degradable water-soluble photosensitive resin, application and preparation method thereof 中国地质大学(武汉) 2024-03-08 CN claimed
WO-2024007741-A1 INK COMPOSITION, PACKAGING STRUCTURE, AND SEMICONDUCTOR DEVICE 杭州福斯特应用材料股份有限公司 2024-01-11 WO claimed
CN-114544803-B HPLC analysis method for photoresist resin monomer acrylic ester compound 河北凯诺中星科技有限公司 2023-12-26 CN claimed
EP-1411389-A1 Photoresists with hydroxylated, photoacid-cleavable groups E.I. du Pont de Nemours and Company (US) 2004-04-21 EP claimed
WO-2004022612-A1 PHOTORESISTS, FLUOROPOLYMERS AND PROCESSES FOR 157 NM MICROLITHOGRAPHY E. I. DU PONT DE NEMOURS AND COMPANY (US) 2004-03-18 WO claimed
WO-2004014960-A2 FLUORINATED MONOMERS, FLUORINATED POLYMERS HAVING POLYCYCLIC GROUPS WITH FUSED 4-MEMBERED HETEROCYCLIC RINGS, USEFUL AS PHOTORESISTS, AND PROCESSES FOR MICROLITHOGRAPHY E. I. DU PONT DE NEMOURS AND COMPANY (US) 2004-02-19 WO claimed
WO-2004014964-A2 PHOTORESISTS, FLUORINATED POLYMERS AND PROCESSES FOR 157 nm MICROLITHOGRAPHY E. I. DU PONT DE NEMOURS AND COMPANY (US) 2004-02-19 WO claimed
US-6692888-B1 TERPOLYMER OF SUCH AS 2-METHYLADAMANTANYL METHACRYLATE, METHACRYLONITRILE AND ALPHA-BUTYROLACTONE METHACRYLATE; SHORT WAVELENGTH IMAGING; PLASMA ETCHANT RESISTANCE SHIPLEY COMPANY, L.L.C. 2004-02-17 US claimed
WO-2004011509-A1 FLUORINATED POLYMERS, PHOTORESISTS AND PROCESSES FOR MICROLITHOGRAPHY E. I. DU PONT DE NEMOURS AND COMPANY (US) 2004-02-05 WO claimed
US-20030215742-A1 Novel copolymers and photoresist compositions comprising same BARCLAY GEORGE G (US) 2003-11-20 US claimed
WO-2003040827-A1 FLUORINATED POLYMERS HAVING ESTER GROUPS AND PHOTORESISTS FOR MICROLITHOGRAPHY E. I. DU PONT DE NEMOURS AND COMPANY (US) 2003-05-15 WO claimed
EP-1128213-A2 Photoresist compositions comprising novel copolymers Shipley Company LLC (US) 2001-08-29 EP claimed
EP-1091249-A1 Copolymers having nitride and alicyclic leaving groups and photoresist compositions comprising same Shipley Company LLC (US) 2001-04-11 EP claimed