⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9474069 | 0.91 | — | — | |
| Ammonia Solution, Strong SCHEMBL15440386 | 0.91 | — | — | |
| SCHEMBL28173733 | 0.74 | — | — | |
| SCHEMBL707236 | 0.68 | — | — | |
| SCHEMBL400341 | 0.68 | — | — | |
| SCHEMBL232551 | 0.67 | — | — | |
| SCHEMBL332861 | 0.63 | — | — | |
| SCHEMBL87772 | 0.63 | — | — | |
| SCHEMBL9233111 | 0.63 | — | — | |
| SCHEMBL2567991 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 507 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12428722-B2 | Compositions and methods using same for deposition of silicon-containing film | VERSUM MATERIALS US, LLC (US) | 2025-09-30 | — | — | US | claimed |
| US-20250270694-A1 | PROCESSING APPARATUS, PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Kokusai Electric Corporation (JP) | 2025-08-28 | — | — | US | claimed |
| US-12281386-B2 | Method of processing substrate for forming film containing silicon by supplying precursor containing Si—C bonds | Kokusai Electric Corporation (JP) | 2025-04-22 | — | — | US | claimed |
| WO-2024243002-A1 | LOW PRESSURE CHEMICAL VAPOR DEPOSITION OF SILICON OXIDE | LAM RESEARCH CORPORATION (US) | 2024-11-28 | — | — | WO | claimed |
| US-20240339358-A1 | METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES | APPLIED MATERIALS, INC. (US) | 2024-10-10 | — | — | US | claimed |
| WO-2024211169-A1 | METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES | APPLIED MATERIALS, INC. (US) | 2024-10-10 | — | — | WO | claimed |
| US-20230357926-A1 | SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM FOR FORMING CONTAINING SILICON | Kokusai Electric Corporation (JP) | 2023-11-09 | — | — | US | claimed |
| US-11746416-B2 | Method of processing substrate and manufacturing semiconductor device by forming film containing silicon | Kokusai Electric Corporation (JP) | 2023-09-05 | — | — | US | claimed |
| CN-116603524-A | Rh (rhodium)&MnO 2 Composite catalyst and preparation method and application thereof | 杭州师范大学钱江学院 | 2023-08-18 | — | — | CN | claimed |
| EP-2962987-B1 | AMINO CATALYZED PRODUCTION OF HYDROGEN FROM SILYLATED DERIVATIVES AS HYDROGEN CARRIER | HYSILABS (FR) | 2023-08-09 | — | — | EP | claimed |
| EP-2228465-A1 | Methods for making dielectric films comprising silicon | Air Products and Chemicals, Inc. (US) | 2010-09-15 | — | — | EP | claimed |
| US-20090181178-A1 | SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-16 | — | — | US | claimed |
| US-20080265381-A1 | SiCOH DIELECTRIC | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-30 | — | — | US | claimed |
| WO-2008094840-A2 | HYDROGEN GENERATION PROCESSES USING SILICON COMPOUNDS | HYDROGEN SOLUTIONS INTERNATIONAL (US) | 2008-08-07 | — | — | WO | claimed |
| US-20070173071-A1 | SiCOH dielectric | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-07-26 | — | — | US | claimed |
| US-20060165891-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-07-27 | — | — | US | claimed |
| US-20050194619-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-09-08 | — | — | US | claimed |
| EP-1326926-A1 | COLOR EFFECT MATERIALS AND PRODUCTION THEREOF | ENGELHARD CORPORATION (US) | 2003-07-16 | — | — | EP | claimed |
| US-6475273-B1 | Color effect materials and production thereof | ENGELHARD CORPORATION | 2002-11-05 | — | — | US | claimed |
| WO-2002026894-A1 | COLOR EFFECT MATERIALS AND PRODUCTION THEREOF | ENGELHARD CORPORATION (US) | 2002-04-04 | — | — | WO | claimed |