Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.47 |
| ▸ | MAPT | P10636 | 5/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.47 |
| ▸ | MEN1 | O00255 | 3/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.47 |
| ▸ | MITF | O75030 | 1/20 | 0.47 |
| ▸ | GAA | P10253 | 1/20 | 0.47 |
| ▸ | GFER | P55789 | 1/20 | 0.47 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.47 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.47 |
| ▸ | TSHR | P16473 | 2/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.42 |
| ▸ | NR4A1 | P22736 | 1/20 | 0.42 |
| ▸ | MAOA | P21397 | 2/20 | 0.41 |
| ▸ | TEAD4 | Q15561 | 1/20 | 0.40 |
| ▸ | MAOB | P27338 | 1/20 | 0.40 |
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.40 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10945153 | 0.93 | NR4A1 (0.48) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL11578105 | 0.89 | TSHR (0.54) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL10866211 | 0.86 | ALDH1A1 (0.50) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL24405304 | 0.80 | ALDH1A1 (0.36) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL10707842 | 0.77 | HDAC1 (0.43) | ALDH1A1MEN1KMT2ATDP1CYP3A4 | |
| SCHEMBL9816025 | 0.77 | ALDH1A1 (0.52) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL14468465 | 0.77 | ALDH1A1 (0.56) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL9347449 | 0.77 | TSHR (0.51) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL14468479 | 0.75 | ALDH1A1 (0.65) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A | |
| SCHEMBL11577876 | 0.75 | TSHR (0.54) | ALDH1A1MAPTSMN1; SMN2MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0277915-B1 | PHOTOINITIATOR MIXTURE CONTAINING A TITANOCENE AND A 3-KETOCOUMARIN | CIBA-GEIGY AG (CH) | 1991-09-04 | — | — | EP | claimed |
| US-5011755-A | Relief Images | CIBA-GEIGY CORPORATION (US) | 1991-04-30 | — | — | US | claimed |
| EP-0119162-B1 | PHOTOPOLYMERISABLE COMPOSITION, MATERIAL COATED THEREWITH, AND PROCESS FOR OBTAINING RELIEF IMAGES | CIBA-GEIGY AG (CH) | 1988-03-23 | — | — | EP | claimed |
| US-4548891-A | PHOTORESISTS; HEAT RESISTANCE; THICKNESS; SHARPNESS | CIBA GEIGY CORPORATION (US) | 1985-10-22 | — | — | US | claimed |
| US-7521744-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. (JP) | 2009-04-21 | — | — | US | disclosed |
| US-7064368-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. (JP) | 2006-06-20 | — | — | US | disclosed |
| US-20050248014-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. | 2005-11-10 | — | — | US | disclosed |
| US-20050046047-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2005-03-03 | — | — | US | disclosed |
| US-6847125-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | RENESAS TECHNOLOGY CORP. (JP) | 2005-01-25 | — | — | US | disclosed |
| US-20040084785-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2004-05-06 | — | — | US | disclosed |
| US-6657245-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. (JP) | 2003-12-02 | — | — | US | disclosed |
| US-6617630-B2 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. (JP) | 2003-09-09 | — | — | US | disclosed |
| US-20020027268-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2002-03-07 | — | — | US | disclosed |
| US-6147374-A | Resin-encapsulated semiconductor apparatus | HITACHI, LTD. (JP) | 2000-11-14 | — | — | US | disclosed |
| EP-0446032-B1 | Wet-etch process and composition | AMOCO CORP (US) | 1995-05-24 | — | — | EP | disclosed |
| US-5011755-A | Relief Images | CIBA-GEIGY CORPORATION (US) | 1991-04-30 | — | — | US | disclosed |
| EP-0208293-B1 | A FERROELECTRIC LIQUID CRYSTAL ELEMENT AND A METHOD FOR MANUFACTURING THE SAME | HITACHI, LTD. (JP) | 1990-02-21 | — | — | EP | disclosed |
| US-4759614-A | Ferroelectric liquid crystal element with particular alignment film and a method for manufacturing the same | HITACHI, LTD. (JP) | 1988-07-26 | — | — | US | disclosed |
| EP-0208293-A1 | A ferroelectric liquid crystal element and a method for manufacturing the same | HITACHI, LTD. (JP) | 1987-01-14 | — | — | EP | disclosed |
| US-4548891-A | PHOTORESISTS; HEAT RESISTANCE; THICKNESS; SHARPNESS | CIBA GEIGY CORPORATION (US) | 1985-10-22 | — | — | US | disclosed |