SCHEMBL40406

SCHEMBL40406

c1ccc2c(c1)CN(c1ccc(Cc3ccc(N4COc5ccccc5C4)cc3)cc1)CO2

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 5/20 0.47
RAB9A P51151 5/20 0.47
KDM4E B2RXH2 1/20 0.47
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
GAA P10253 1/20 0.40
MAPT P10636 3/20 0.37
ALDH1A1 P00352 2/20 0.37
TP53 P04637 1/20 0.37
BACE1 P56817 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
OXTR P30559 1/20 0.33
VDR P11473 1/20 0.32
HSD17B3 P37058 1/20 0.32
PKM P14618 1/20 0.32
EED O75530 1/20 0.32
TSHR P16473 1/20 0.31
ADRA2A P08913 1/20 0.31
ADRA2B P18089 1/20 0.31
ADRA2C P18825 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15358692 1.00 NPC1 (0.47) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL15358745 1.00 NPC1 (0.47) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL14374001 0.97 NPC1 (0.45) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL15358725 0.95 NPC1 (0.44) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL15358691 0.93 NPC1 (0.45) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL19404939 0.93 RAB9A (0.42) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL18328646 0.92 NPC1 (0.41) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL15358746 0.90 NPC1 (0.47) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL15358741 0.90 NPC1 (0.47) NPC1RAB9AKDM4EMEN1KMT2A
SCHEMBL20612947 0.90 CYP1A2 (0.44) NPC1RAB9AKDM4EMAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 325 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111662532-B Resin composition 味之素株式会社 2025-04-15 CN disclosed
EP-3191541-B1 CATIONICALLY CURABLE BENZOXAZINE COMPOSITIONS HENKEL AG & CO KGAA (DE) 2025-03-12 EP disclosed
US-12030992-B2 Photocurable composition CANON KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
US-20240026069-A1 POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT JSR CORPORATION (JP) 2024-01-25 US disclosed
US-20240026069-A1 POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT JSR CORPORATION (JP) 2024-01-25 US disclosed
EP-4289882-A1 COMPOSITION FOR CURABLE RESINS, CURED PRODUCT OF SAID COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION, METHOD FOR PRODUCING SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE ENEOS Corporation (JP) 2023-12-13 EP disclosed
EP-3553129-B1 CURING RESIN COMPOSITION, CURED PRODUCT OF, AND CURING METHOD FOR, CURING RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE ENEOS CORP (JP) 2023-11-22 EP disclosed
EP-3450499-B1 COMPOSITION FOR CURABLE RESIN, AND CURED PRODUCT THEREOF ENEOS CORP (JP) 2023-11-01 EP disclosed
US-20230331916-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2023-10-19 US disclosed
US-20230331916-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2023-10-19 US disclosed
US-20080045688-A1 Processes of synthesizing aromatic amine-based benzoxazine resins NATIONAL CHUNGHSING UNIVERSITY 2008-02-21 US disclosed
US-20080045688-A1 Processes of synthesizing aromatic amine-based benzoxazine resins NATIONAL CHUNGHSING UNIVERSITY 2008-02-21 US disclosed
US-7312534-B2 Interlayer dielectric and pre-applied die attach adhesive materials HENKEL CORPORATION (US) 2007-12-25 US disclosed
US-7312534-B2 Interlayer dielectric and pre-applied die attach adhesive materials HENKEL CORPORATION (US) 2007-12-25 US disclosed
US-20070278683-A1 Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials HENKEL CORPORATION (US) 2007-12-06 US disclosed
US-20070278683-A1 Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials HENKEL CORPORATION (US) 2007-12-06 US disclosed
US-20070129509-A1 Curable compositions HENKEL CORPORATION 2007-06-07 US disclosed
US-20070129509-A1 Curable compositions HENKEL CORPORATION 2007-06-07 US disclosed
US-20070007692-A1 Curable compositions for advanced processes, and products made therefrom Henkel IP & Holding GmbH (DE) 2007-01-11 US disclosed
US-20070007692-A1 Curable compositions for advanced processes, and products made therefrom Henkel IP & Holding GmbH (DE) 2007-01-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070129509-A1 Curable compositions CBX4, CBX7, KDM5C NPC1 4543/4885RAB9A 4196/4885KDM4E 146/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.