⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL34344 | 0.96 | — | — | |
| SCHEMBL16197636 | 0.96 | LMNA (0.47) | — | |
| Cyclohexane SCHEMBL6541885 | 0.88 | ALDH1A1 (0.41) | — | |
| SCHEMBL21784922 | 0.85 | LMNA (0.48) | — | |
| SCHEMBL7109252 | 0.85 | LMNA (0.48) | — | |
| SCHEMBL493857 | 0.80 | CA1 (0.53) | — | |
| SCHEMBL715968 | 0.80 | — | — | |
| SCHEMBL3093303 | 0.77 | CA1 (0.50) | — | |
| SCHEMBL17672300 | 0.77 | CA1 (0.50) | — | |
| SCHEMBL9788227 | 0.77 | CA1 (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101489920-B | Coating fluid, conductive thin film formed from coating fluid, and method of forming the same | TOKAI RYOKAKU TETSUDO K K | 2013-07-10 | — | — | CN | disclosed |
| US-8445118-B2 | Coating liquid, metal compound film formed by coating liquid, and forming method thereof | CENTRAL JAPAN RAILWAY COMPANY (JP) | 2013-05-21 | — | — | US | disclosed |
| US-20090324963-A1 | COATING LIQUID, METAL COMPOUND FILM FORMED BY COATING LIQUID, AND FORMING METHOD THEREOF | CENTRAL JAPAN RAILWAY COMPANY (JP) | 2009-12-31 | — | — | US | disclosed |
| CN-101489920-A | Coating fluid, conductive thin film formed from coating fluid, and method of forming the same | TOKAI RYOKAKU TETSUDO KK (JP) | 2009-07-22 | — | — | CN | disclosed |
| EP-2048111-A1 | COATING LIQUID, METAL COMPOUND THIN FILM FORMED BY USING COATING LIQUID, AND METHOD FOR FORMING THE SAME | Central Japan Railway Company (JP) | 2009-04-15 | — | — | EP | disclosed |