SCHEMBL4079752

SCHEMBL4079752

C=CCc1ccccc1[Si](Cl)(Cl)Cl

nearest known ligand 0.50

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 2/20 0.42
GABRB2 P47870 2/20 0.42
ALDH1A1 P00352 4/20 0.38
ADRA2B P18089 6/20 0.36
ADRA2C P18825 6/20 0.36
ADRA2A P08913 5/20 0.36
HTR1A P08908 3/20 0.36
NISCH Q9Y2I1 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.35
KDM4E B2RXH2 1/20 0.34
KCNH2 Q12809 1/20 0.33
AKR1B1 P15121 1/20 0.33
MEN1 O00255 1/20 0.33
LMNA P02545 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3772407 0.84 GABRA1 (0.40) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL12848969 0.79 GABRA1 (0.42) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL10389350 0.78 GABRA1 (0.41) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL173300 0.77 GABRA1 (0.56) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL29763626 0.77 GABRA1 (0.56) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
Phosphine SCHEMBL28908229 0.74 GABRA1 (0.54) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL10528834 0.74 GABRA1 (0.54) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL11765775 0.74 GABRA1 (0.54) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL19437729 0.74 GABRA1 (0.54) GABRA1GABRB2ALDH1A1ADRA2BADRA2C
SCHEMBL723201 0.73 GABRA1 (0.38) GABRA1GABRB2ALDH1A1ADRA2BADRA2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
CN-114055975-B Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2023-05-12 CN disclosed
CN-114055975-A Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2022-02-18 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-9579852-B2 Method for manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2017-02-28 US disclosed
US-20160339602-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2016-11-24 US disclosed
US-20160263829-A1 THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM SEIKO EPSON CORPORATION (JP) 2016-09-15 US disclosed
US-9415545-B2 Method of manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2016-08-16 US disclosed
WO-2016067584-A1 METHOD FOR MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2016-05-06 WO disclosed
US-20150231798-A1 APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, METHOD OF MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2015-08-20 US disclosed
US-20150210016-A1 METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2015-07-30 US disclosed
US-20150140295-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, THREE-DIMENSIONAL SHAPED OBJECT, THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING APPARATUS, METHOD OF CONTROLLING THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING APPARATUS, AND PROGRAM FOR CONTROLLING THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING APPARATUS SEIKO EPSON CORPORATION (JP) 2015-05-21 US disclosed
US-8322033-B2 Method for forming a conductive post for a multilayered wiring substrate SEIKO EPSON CORPORATION (JP) 2012-12-04 US disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed
US-6022987-A Aryl substituted alkylsilanes and a preparation method thereof KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2000-02-08 US disclosed