SCHEMBL4108178

SCHEMBL4108178

C=C(C)C(=O)OC12CC3CC(CC(OCC(=O)OC(C)(C)C)(C3)C1)C2

nearest known ligand 0.36

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.33
MEN1 O00255 1/20 0.30
MAPK1 P28482 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2208065 0.83 MEN1 (0.33) EPHX2MEN1MAPK1KMT2A
SCHEMBL15215840 0.83 POLB (0.31)
SCHEMBL16543389 0.83
SCHEMBL17735904 0.81
SCHEMBL737596 0.81 ALDH1A1 (0.35)
SCHEMBL14466004 0.81 EPHX2 (0.33) EPHX2MEN1MAPK1KMT2A
SCHEMBL19862666 0.80 CYP17A1 (0.30)
SCHEMBL12170588 0.80 DPP4 (0.33)
SCHEMBL12153603 0.80 GAA (0.33) EPHX2
SCHEMBL12777578 0.79 ELANE (0.44) EPHX2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9164387-B2 Pattern-forming method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2015-10-20 US disclosed
US-9164387-B2 Pattern-forming method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2015-10-20 US disclosed
US-9122163-B2 2015-09-01 US disclosed
US-9122163-B2 2015-09-01 US disclosed
US-20130224661-A1 PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2013-08-29 US disclosed
US-20130224661-A1 PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2013-08-29 US disclosed
US-20090253881-A1 POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER IDEMITSU KOSAN CO., LTD. (JP) 2009-10-08 US disclosed
US-20090253881-A1 POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER IDEMITSU KOSAN CO., LTD. (JP) 2009-10-08 US disclosed
EP-1882705-A1 POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER IDEMITSU KOSAN CO., LTD. (JP) 2008-01-30 EP disclosed