Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL411798

N.[B+3].[Cl-].[Cl-].[Cl-]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Ammonia Solution, Strong. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 279 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024075480-A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER 三菱瓦斯化学株式会社 2024-04-11 WO claimed
CN-117810280-A High-reflectivity black grid glass solar cell backboard and preparation method and application thereof 苏州赛伍应用技术股份有限公司 2024-04-02 CN claimed
CN-115305022-B Epoxy resin electronic pouring sealant and preparation method and application thereof 华烁科技股份有限公司 2024-03-26 CN claimed
WO-2023132360-A1 THERMOSETTING RESIN COMPOSITION ナガセケムテックス株式会社 2023-07-13 WO claimed
US-20230174773-A1 CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING HENKEL AG & CO. KGAA (DE) 2023-06-08 US claimed
CN-115916862-A Conductive epoxy resin composition for copper bonding 汉高股份有限及两合公司 2023-04-04 CN claimed
CN-115305022-A Epoxy resin electronic pouring sealant and preparation method and application thereof 华烁科技股份有限公司 2022-11-08 CN claimed
WO-2022011494-A1 CONDUCTIVE EPOXY RESIN COMPOSITION FOR COPPER BONDING HENKEL AG & CO. KGAA (DE) 2022-01-20 WO claimed
CN-111378345-B Water-based silicon steel sheet self-adhesive paint and preparation method thereof 浙江荣泰科技企业有限公司 2021-10-22 CN claimed
CN-112724369-A Composite curing agent and epoxy resin composition prepared from same 广东盈骅新材料科技有限公司 2021-04-30 CN claimed
US-5331062-A Polyurethane-epoxy interpenetrating polymer network acoustic damping material THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 1994-07-19 US claimed
WO-1990005156-A1 EXPANDING RESINS AND APPLICATIONS THEREOF IN ELECTRICAL SYSTEMS ELECTRIC POWER RESEARCH INSTITUTE, INC. (US) 1990-05-17 WO claimed
EP-0186326-B1 ACID ANHYDRIDE MIXTURES IN PASTE FORM USEFUL FOR CURING EPOXY RESINS AND A DUAL CATALYST SYSTEM THEREFOR FORD MOTOR COMPANY LIMITED (GB) 1989-07-26 EP claimed
US-4663072-A HIGH MELTING POINT ANHYDRIDE LIQUID ANHYDRIDE, AND LOW MELTING POINT ANHYDRIDE FORD MOTOR COMPANY (US) 1987-05-05 US claimed
EP-0186326-A2 Acid anhydride mixtures in paste form useful for curing epoxy resins and a dual catalyst system therefor FORD MOTOR COMPANY LIMITED (GB) 1986-07-02 EP claimed
EP-0110968-A1 EPOXY COATING POWDERS WITH WRINKLE FINISHES THE POLYMER CORPORATION (US) 1984-06-20 EP claimed
WO-1983004195-A1 EPOXY COATING POWDERS WITH WRINKLE FINISHES THE POLYMER CORPORATION (US) 1983-12-08 WO claimed
EP-0058149-A4 EPOXY COATING POWDERS. POLYMER CORP (US) 1982-12-20 EP claimed
EP-0058149-A1 EPOXY COATING POWDERS THE POLYMER CORPORATION (US) 1982-08-25 EP claimed
WO-1982000651-A1 EPOXY COATING POWDERS HOUSENICK J 1982-03-04 WO claimed