SCHEMBL4164758

SCHEMBL4164758

CC1=C(C)C2(C)CCC1(C)C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9717659 0.85
SCHEMBL2358857 0.78
SCHEMBL9589095 0.63 TP53 (0.39)
SCHEMBL5591412 0.62
SCHEMBL20627971 0.60 RXRA (0.32)
SCHEMBL29992254 0.59
SCHEMBL18741243 0.59
SCHEMBL910630 0.59
SCHEMBL11253651 0.58 ACHE (0.30)
SCHEMBL3692439 0.57 OPRD1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090004508-A1 Thin-film materials, thin films and producing method thereof DAICEL CHEMICAL INDUSTRIES, LTD. 2009-01-01 US disclosed
EP-2003123-A2 Thin-film materials, thin films and producing method thereof Daicel Chemical Industries, Ltd. (JP) 2008-12-17 EP disclosed
US-20070078256-A1 Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-04-05 US disclosed
EP-1683822-A1 PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM Daicel Chemical Industries, Ltd. (JP) 2006-07-26 EP disclosed