Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.56 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.54 |
| ▸ | SLC22A6 | Q4U2R8 | 2/20 | 0.52 |
| ▸ | GPR84 | Q9NQS5 | 7/20 | 0.52 |
| ▸ | PPARG | P37231 | 7/20 | 0.52 |
| ▸ | PPARD | Q03181 | 7/20 | 0.52 |
| ▸ | PPARA | Q07869 | 7/20 | 0.52 |
| ▸ | HDAC11 | Q96DB2 | 5/20 | 0.52 |
| ▸ | PTPN1 | P18031 | 3/20 | 0.52 |
| ▸ | TLR2 | O60603 | 2/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.52 |
| ▸ | FABP4 | P15090 | 2/20 | 0.52 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.52 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.52 |
| ▸ | MEN1 | O00255 | 1/20 | 0.52 |
| ▸ | ESR1 | P03372 | 1/20 | 0.52 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.52 |
| ▸ | PDE4A | P27815 | 1/20 | 0.52 |
| ▸ | PDE3A | Q14432 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butane SCHEMBL7798141 | 0.98 | TSHR (0.58) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL3518082 | 0.93 | ALDH1A1 (0.68) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| Valeric Acid SCHEMBL28919495 | 0.91 | AKR1B1 (0.61) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL16632868 | 0.91 | TSHR (0.60) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL19925 | 0.90 | SLC22A6 (0.65) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL1289888 | 0.90 | SLC22A6 (0.65) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL1897676 | 0.89 | GPR84 (0.71) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL27775207 | 0.88 | AKR1B1 (0.73) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL3515582 | 0.88 | AKR1B1 (0.65) | TSHRALDH1A1AKR1B1SLC22A6GPR84 | |
| SCHEMBL1160657 | 0.88 | ALDH1A1 (0.68) | TSHRALDH1A1AKR1B1SLC22A6GPR84 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250294930-A1 | SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME | HANSOL CHEMICAL CO., LTD. (KR) | 2025-09-18 | — | — | US | claimed |
| EP-4516832-A1 | SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME | Hansol Chemical Co., Ltd. (KR) | 2025-03-05 | — | — | EP | claimed |
| CN-117603276-A | Epoxy resin curing agent and preparation method and application thereof | 上海玟昕科技有限公司 | 2024-02-27 | — | — | CN | claimed |
| CN-117586243-A | Triglycidyl isocyanurate epoxy resin and preparation method and application thereof | 上海玟昕科技有限公司 | 2024-02-23 | — | — | CN | claimed |
| CN-107849417-B | Adhesive composition, cured product, semiconductor device, and method for producing same | 昭和电工材料株式会社 | 2021-06-29 | — | — | CN | claimed |
| CN-106047059-A | Powder coating with good weather resistance and method for preparing powder coating | 合肥市燕美粉末涂料有限公司 | 2016-10-26 | — | — | CN | claimed |
| CN-105936800-A | Powder paint for freezer shell and preparation method thereof | 合肥市燕美粉末涂料有限公司 | 2016-09-14 | — | — | CN | claimed |
| CN-105925134-A | Low-temperature-curing powder coating containing cerium oxide and preparation method thereof | 合肥市燕美粉末涂料有限公司 | 2016-09-07 | — | — | CN | claimed |
| CN-105860766-A | Low-temperature curing polyester/epoxy powder coating and preparation method thereof | 合肥市燕美粉末涂料有限公司 | 2016-08-17 | — | — | CN | claimed |
| US-20250294930-A1 | SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME | HANSOL CHEMICAL CO., LTD. (KR) | 2025-09-18 | — | — | US | disclosed |
| US-20250215208-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA, AND IMAGE DISPLAY DEVICE | RESONAC CORP (JP) | 2025-07-03 | — | — | US | disclosed |
| US-20250215133-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, TRANSPARENT ANTENNA AND IMAGE DISPLAY DEVICE | RESONAC CORP (JP) | 2025-07-03 | — | — | US | disclosed |
| EP-4516832-A1 | SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME | Hansol Chemical Co., Ltd. (KR) | 2025-03-05 | — | — | EP | disclosed |
| CN-115210287-B | Epoxy amine adduct, curing catalyst, resin composition, sealing material, adhesive, and cured product | 纳美仕有限公司 | 2024-07-02 | — | — | CN | disclosed |
| US-20140066543-A1 | THERMOSETTING LIGHT-REFLECTIVE RESIN COMPOSITION, METHOD FOR PREPARING THE SAME, OPTICAL SEMICONDUCTOR ELEMENT-MOUNTED REFLECTOR PRODUCED THEREFROM, AND OPTICAL SEMICONDUCTOR DEVICE COMPRISING THE SAME | NEPESAMC (KR) | 2014-03-06 | — | — | US | disclosed |
| US-20130001622-A1 | SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF, OPTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THEREOF | KOTANI HAYATO (JP) | 2013-01-03 | — | — | US | disclosed |
| US-8212271-B2 | Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2012-07-03 | — | — | US | disclosed |
| US-20090136732-A1 | THERMOSET RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20090095969-A1 | Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof | HITACHI CHEMICAL CO., LTD. | 2009-04-16 | — | — | US | disclosed |
| WO-2007116986-A1 | THERMOSET RESIN COMPOSITION | SHOWA DENKO K. K. (JP) | 2007-10-18 | — | — | WO | disclosed |