Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.42 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.35 |
| ▸ | PDE4A | P27815 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.35 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.35 |
| ▸ | BLM | P54132 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17819134 | 0.98 | APP (0.41) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL458345 | 0.86 | APP (0.39) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL220968 | 0.85 | APP (0.50) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL17819146 | 0.85 | APP (0.38) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL10484571 | 0.82 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1258894 | 0.82 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL929912 | 0.82 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL21808785 | 0.82 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL211369 | 0.82 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1646543 | 0.82 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 269 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11746433-B2 | Single step electrolytic method of filling through holes in printed circuit boards and other substrates | MACDERMID ENTHONE INC. (US) | 2023-09-05 | — | — | US | claimed |
| US-10982343-B2 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-04-20 | — | — | US | claimed |
| US-20200347504-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-11-05 | — | — | US | claimed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | claimed |
| EP-3483307-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH Deutschland GmbH (DE) | 2019-05-15 | — | — | EP | claimed |
| EP-2576867-B1 | METHOD FOR ETCHING SURFACES OF CIRCUIT STRUCTURES OF PLATED COPPER AND PLATED COPPER ALLOYS | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-04-04 | — | — | EP | claimed |
| US-9869029-B2 | Composition for metal plating comprising suppressing agent for void free submicron feature filling | BASF SE (DE) | 2018-01-16 | — | — | US | claimed |
| US-9493886-B2 | Low internal stress copper electroplating method | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-11-15 | — | — | US | claimed |
| CN-106086954-A | Acidic copper electroplating bath and method for electroplating copper deposits with low internal stress and excellent ductility | 罗门哈斯电子材料有限责任公司 | 2016-11-09 | — | — | CN | claimed |
| EP-3088570-A2 | ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTILITY COPPER DEPOSITS | Rohm and Haas Electronic Materials LLC (US) | 2016-11-02 | — | — | EP | claimed |
| EP-1651801-B1 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-01-23 | — | — | EP | claimed |
| EP-0785297-B1 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH DEUTSCHLAND GMBH (DE) | 2000-01-05 | — | — | EP | claimed |
| EP-0785297-A2 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH Deutschland GmbH (DE) | 1997-07-23 | — | — | EP | claimed |
| EP-0598763-B1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-12-13 | — | — | EP | claimed |
| EP-0554275-B1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | ATOTECH DEUTSCHLAND GMBH (DE) | 1994-12-14 | — | — | EP | claimed |
| EP-0554275-A1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE. | SCHERING AG (DE) | 1993-08-11 | — | — | EP | claimed |
| EP-0297306-B1 | AQUEOUS ACID BATH FOR THE GALVANIC DEPOSITION OF BRIGHTENING AND LEVELING COPPER COATINGS | SCHERING AKTIENGESELLSCHAFT (DE) | 1993-01-20 | — | — | EP | claimed |
| WO-1992007116-A1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | SCHERING AKTIENGESELLSCHAFT (DE) | 1992-04-30 | — | — | WO | claimed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | claimed |
| EP-0297306-A1 | Aqueous acid bath for the galvanic deposition of brightening and leveling copper coatings | SCHERING AKTIENGESELLSCHAFT (DE) | 1989-01-04 | — | — | EP | claimed |