SCHEMBL423768

SCHEMBL423768

CCCCCCC(OC)C(C)OCC(C)OCC(C)OCC(C)O

nearest known ligand 0.44

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.44
MAPT P10636 1/20 0.37
SPHK1 Q9NYA1 1/20 0.35
FAAH O00519 5/20 0.33
PTPN1 P18031 1/20 0.33
ZDHHC7 Q9NXF8 1/20 0.32
GPR84 Q9NQS5 4/20 0.32
FFAR1 O14842 1/20 0.32
ABCB1 P08183 1/20 0.31
HSD17B10 Q99714 1/20 0.31
LMNA P02545 1/20 0.31
CNR1 P21554 1/20 0.31
CNR2 P34972 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL429771 1.00 TDP1 (0.44) TDP1MAPTSPHK1FAAHPTPN1
SCHEMBL426341 0.94 TDP1 (0.46) TDP1MAPTHSD17B10
SCHEMBL429420 0.94 TDP1 (0.46) TDP1MAPTHSD17B10
SCHEMBL429521 0.94 MAPT (0.41) TDP1MAPTSPHK1PTPN1ZDHHC7
SCHEMBL17654662 0.89 TDP1 (0.38) TDP1
SCHEMBL4314541 0.87 TDP1 (0.49) TDP1HSD17B10
SCHEMBL432085 0.87 TDP1 (0.39) TDP1MAPTHSD17B10
SCHEMBL4321415 0.81 TDP1 (0.46) TDP1MAPTHSD17B10LMNA
SCHEMBL15970081 0.81 MAPT (0.41) TDP1MAPTSPHK1PTPN1GPR84
SCHEMBL428361 0.80 TDP1 (0.47) TDP1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12252587-B2 Curable resin composition, thin film, and color conversion panel and display device including thin film SAMSUNG SDI CO., LTD. (KR) 2025-03-18 US disclosed
US-20240142874-A1 NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-05-02 US disclosed
CN-115551934-B Curable resin composition, cured film prepared therefrom, and electronic device comprising cured film 三星SDI株式会社 2024-03-12 CN disclosed
CN-115109413-B Curable resin composition, film, color conversion panel, and display device 三星SDI株式会社 2024-02-02 CN disclosed
CN-115551934-A Curable resin composition, cured film formed therefrom, and electronic device having cured film 三星SDI株式会社 2022-12-30 CN disclosed
US-20220306809-A1 CURABLE RESIN COMPOSITION, THIN FILM, AND COLOR CONVERSION PANEL AND DISPLAY DEVICE INCLUDING THIN FILM SAMSUNG SDI CO., LTD. (KR) 2022-09-29 US disclosed
CN-115109413-A Curable resin composition, film, color conversion panel, and display device 三星SDI株式会社 2022-09-27 CN disclosed
US-20220179138-A1 WAVELENGTH CONVERSION MEMBER AND UTILIZATION THEREOF, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-06-09 US disclosed
CN-108391449-B Method for manufacturing semiconductor element and method for manufacturing solar cell 东丽株式会社 2022-05-17 CN disclosed
CN-113557456-A Wavelength conversion member, application thereof, backlight unit and image display device 昭和电工材料株式会社 2021-10-26 CN disclosed
US-20120021190-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING SILICA COATING FILM, AND APPARATUS AND MEMBER EACH COMPRISING SILICA COATING FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-01-26 US disclosed
US-20110256658-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2011-10-20 US disclosed
US-20110195541-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2011-08-11 US disclosed
EP-2348546-A2 Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell Hitachi Chemical Co., Ltd. (JP) 2011-07-27 EP disclosed
US-20100102321-A1 RADIATION-SENSITIVE COMPOSITION, METHOD OF FORMING SILICA-BASED COATING FILM, SILICA-BASED COATING FILM, APPARATUS AND MEMBER HAVING SILICA-BASED COATING FILM AND PHOTOSENSITIZING AGENT FOR INSULATING FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-04-29 US disclosed
US-20090251652-A1 Silica based positive type photosensitive organic compound HITACHI CHEMICAL CO., LTD. 2009-10-08 US disclosed
US-20090214796-A1 Method for Forming Antireflection Film MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2009-08-27 US disclosed
US-20080260956-A1 Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part HITACHI CHEMICAL CO., LTD. (JP) 2008-10-23 US disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
EP-1829945-A1 FILM, SILICA FILM AND METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING SILICA FILM, AND ELECTRONIC PART Hitachi Chemical Co., Ltd. (JP) 2007-09-05 EP disclosed