SCHEMBL428361

SCHEMBL428361

CCC(OC)C(C)OCC(C)OCC(C)O

nearest known ligand 0.47

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.47
HSD17B10 Q99714 1/20 0.32
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15387104 1.00 TDP1 (0.47) TDP1HSD17B10TSHR
SCHEMBL310106 0.92 TDP1 (0.39) TDP1HSD17B10TSHR
SCHEMBL4314541 0.86 TDP1 (0.49) TDP1HSD17B10
SCHEMBL429420 0.83 TDP1 (0.46) TDP1HSD17B10
SCHEMBL426341 0.83 TDP1 (0.46) TDP1HSD17B10
SCHEMBL429771 0.80 TDP1 (0.44) TDP1HSD17B10
SCHEMBL423768 0.80 TDP1 (0.44) TDP1HSD17B10
SCHEMBL7059595 0.79 TDP1 (0.47) TDP1HSD17B10
SCHEMBL17654662 0.78 TDP1 (0.38) TDP1
SCHEMBL12308430 0.78 TDP1 (0.59) TDP1HSD17B10TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 223 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230249127-A1 RATE ENHANCEMENT OF GAS CAPTURE PROCESSES C-CAPTURE LTD (GB) 2023-08-10 US claimed
EP-4182058-A1 RATE ENHANCEMENT OF GAS CAPTURE PROCESSES C-Capture Ltd. (GB) 2023-05-24 EP claimed
CN-116154270-A Non-aqueous electrolyte of sodium ion battery and sodium ion battery 珠海市赛纬电子材料股份有限公司 2023-05-23 CN claimed
CN-115867372-A Rate enhancement of gas capture process 碳捕获有限公司 2023-03-28 CN claimed
WO-2022013550-A1 RATE ENHANCEMENT OF GAS CAPTURE PROCESSES C-CAPTURE LTD (GB) 2022-01-20 WO claimed
EP-4012726-B1 ADHESIVE CONDUCTIVE PASTE DAICEL CORP (JP) 2025-10-22 EP disclosed
US-12152169-B2 Adhesive conductive paste DAICEL CORPORATION (JP) 2024-11-26 US disclosed
WO-2024219382-A1 LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE 株式会社ダイセル 2024-10-24 WO disclosed
US-20240142874-A1 NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-05-02 US disclosed
CN-115109413-B Curable resin composition, film, color conversion panel, and display device 三星SDI株式会社 2024-02-02 CN disclosed
CN-117396566-A Aqueous ink and ink set comprising same DNP精细化工股份有限公司 2024-01-12 CN disclosed
CN-117396567-A Pretreatment ink and ink set comprising the same DNP精细化工股份有限公司 2024-01-12 CN disclosed
EP-2048196-A1 CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM Daicel Chemical Industries, Ltd. (JP) 2009-04-15 EP disclosed
CN-101398498-A Coloring composite for color filter, color filter, and displaying device for color filter FUJIFILM CORP (JP) 2009-04-01 CN disclosed
CN-101194187-A Method for forming antireflection film HITACHI CHEMICAL CO LTD (JP) 2008-06-04 CN disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
CN-1698017-A Radiation-curing composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide HITACHI CHEMICAL CO LTD (JP) 2005-11-16 CN disclosed
CN-1698018-A Radiation-curable composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide HITACHI CHEMICAL CO LTD (JP) 2005-11-16 CN disclosed
CN-1664707-A Scouring agent and flushing fluid for the planography DAICEL CHEM (JP) 2005-09-07 CN disclosed
US-H1299-H Developing negative photoresist with acid in solubilizing solvent PPG INDUSTRIES, INC. (US) 1994-04-05 US disclosed