SCHEMBL425870

SCHEMBL425870

O=C(O)c1cccc(Oc2ccc(Sc3ccc(Oc4cccc(C(=O)O)c4C(=O)O)cc3)cc2)c1C(=O)O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CTNNB1 P35222 1/20 0.42
KMT2A Q03164 4/20 0.42
POLB P06746 3/20 0.42
MEN1 O00255 3/20 0.42
LMNA P02545 3/20 0.42
MITF O75030 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
ALDH1A1 P00352 5/20 0.41
GAA P10253 1/20 0.41
CRHBP P24387 1/20 0.41
FNTA P49354 1/20 0.41
FNTB P49356 1/20 0.41
CRHR2 Q13324 1/20 0.41
KDM4E B2RXH2 2/20 0.40
CA12 O43570 1/20 0.40
CA1 P00915 1/20 0.40
CA2 P00918 1/20 0.40
CA7 P43166 1/20 0.40
CA9 Q16790 1/20 0.40
CA14 Q9ULX7 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL420308 0.91 POLB (0.50) KMT2APOLBMEN1LMNAMITF
SCHEMBL31105217 0.90 CTNNB1 (0.50) CTNNB1KMT2APOLBMEN1LMNA
SCHEMBL261107 0.90 CTNNB1 (0.50) CTNNB1KMT2APOLBMEN1LMNA
SCHEMBL29658106 0.89 CTNNB1 (0.49) CTNNB1KMT2APOLBMEN1LMNA
SCHEMBL425841 0.89 CTNNB1 (0.49) CTNNB1KMT2APOLBMEN1LMNA
SCHEMBL4100316 0.85 CTNNB1 (0.46) CTNNB1KMT2APOLBMEN1LMNA
SCHEMBL10964895 0.85 CTNNB1 (0.54) CTNNB1KMT2APOLBMEN1LMNA
SCHEMBL29435067 0.85 CTNNB1 (0.58) CTNNB1KMT2APOLBMEN1LMNA
SCHEMBL34487 0.85 CTNNB1 (0.58) CTNNB1KMT2APOLBMEN1LMNA
Sulfur Dioxide SCHEMBL19640822 0.84 CTNNB1 (0.42) CTNNB1KMT2APOLBMEN1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1540 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11905381-B2 Polyimide microparticles XEROX CORPORATION (US) 2024-02-20 US claimed
EP-4089136-A1 POLYIMIDE MICROPARTICLES Xerox Corporation (US) 2022-11-16 EP claimed
US-9975997-B2 Compositions, composites prepared therefrom, and films and electronic devices including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-05-22 US claimed
US-20160280857-A1 COMPOSITIONS, COMPOSITES PREPARED THEREFROM, AND FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-09-29 US claimed
US-20160009862-A1 TRANSPARENT POLYMER FILM AND ELECTRONIC DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-01-14 US claimed
US-9161440-B2 Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2015-10-13 US claimed
EP-2032634-B1 POLYIMIDE SOLVENT CAST FILMS HAVING LOW COEFFICIENT OF THERMAL EXPANSION AND METHOD OF MANUFACTURE THEREOF GEN ELECTRIC (US) 2015-05-13 EP claimed
EP-2041209-B1 ARTICLES COMPRISING A POLYIMIDE SOLVENT CAST FILM HAVING A LOW COEFFICIENT OF THERMAL EXPANSION AND METHOD OF MANUFACTURE THEREOF SABIC INNOVATIVE PLASTICS IP (NL) 2014-11-26 EP claimed
EP-2081977-B1 ARTICLES COMPRISING A POLYIMIDE SOLVENT CAST FILM HAVING A LOW COEFFICIENT OF THERMAL EXPANSION AND METHOD OF MANUFACTURE THEREOF SABIC INNOVATIVE PLASTICS IP (NL) 2013-12-11 EP claimed
US-8568867-B2 Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2013-10-29 US claimed
US-20030181626-A1 Preparation of polyimide polymers SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2003-09-25 US claimed
US-20030125478-A1 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2003-07-03 US claimed
EP-1318174-A1 Method of manufacture of polyester molding compositions and articles produced therefrom GENERAL ELECTRIC COMPANY (US) 2003-06-11 EP claimed
WO-2003040213-A1 HIGH MOLECULAR WEIGHT POLY(IMIDE)S AND METHODS OF SYNTHESIS THEREOF GENERAL ELECTRIC COMPANY (US) 2003-05-15 WO claimed
EP-1287076-A2 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES GENERAL ELECTRIC COMPANY (US) 2003-03-05 EP claimed
US-6500904-B1 FROM THE COUPLING OF LOWER MOLECULAR WEIGHT FUNCTIONALIZED PRECURSOR POLYIMIDES GENERAL ELECTRIC COMPANY 2002-12-31 US claimed
WO-2001096477-A2 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES GENERAL ELECTRIC COMPANY (US) 2001-12-20 WO claimed
US-4925915-A FLUORINE CONTAINING POLYIMIDES HOECHST CELANESE CORP. (US) 1990-05-15 US claimed
EP-0317944-A2 Polymers prepared from 4,4'-bis-(2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed
EP-0158732-A1 Polyetherimide-polyethersulfoneimide copolymers GENERAL ELECTRIC COMPANY (US) 1985-10-23 EP claimed