⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trifluoroacetic Acid SCHEMBL927243 | 0.93 | — | — | |
| SCHEMBL4272683 | 0.83 | — | — | |
| SCHEMBL31272236 | 0.79 | — | — | |
| SCHEMBL7057624 | 0.77 | — | — | |
| SCHEMBL329291 | 0.77 | CA2 (0.30) | — | |
| SCHEMBL29367727 | 0.75 | FAAH (0.31) | — | |
| SCHEMBL2720438 | 0.74 | ELANE (0.34) | — | |
| SCHEMBL4271928 | 0.72 | ALDH1A1 (0.33) | — | |
| SCHEMBL7056315 | 0.72 | — | — | |
| SCHEMBL29438534 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113169060-B | Chamfering part treating agent composition and method for manufacturing wafer | 中央硝子株式会社 | 2025-04-01 | — | — | CN | claimed |
| US-20250066621-A1 | COMPOSITION FOR FILM FORMATION AND METHOD FOR MANUFACTURING SUBSTRATE | CENTRAL GLASS COMPANY, LIMITED (JP) | 2025-02-27 | — | — | US | claimed |
| EP-4459666-A1 | COMPOSITION FOR FILM FORMATION AND METHOD FOR PRODUCING SUBSTRATE | Central Glass Company, Limited (JP) | 2024-11-06 | — | — | EP | claimed |
| CN-118451534-A | Film-forming composition and method for producing substrate | 中央硝子株式会社 | 2024-08-06 | — | — | CN | claimed |
| WO-2024143097-A1 | SUBSTRATE TREATING METHOD AND SUBSTRATE MANUFACTURING METHOD | セントラル硝子株式会社 | 2024-07-04 | — | — | WO | claimed |
| CN-115699259-A | Surface treatment method for semiconductor substrate and surface treatment agent composition | 中央硝子株式会社 | 2023-02-03 | — | — | CN | claimed |
| CN-115668459-A | Surface treatment method for semiconductor substrate and surface treatment agent composition | 中央硝子株式会社 | 2023-01-31 | — | — | CN | claimed |
| US-20220020582-A1 | BEVEL PORTION TREATMENT AGENT COMPOSITION AND METHOD OF MANUFACTURING WAFER | CENTRAL GLASS COMPANY, LIMITED (JP) | 2022-01-20 | — | — | US | claimed |
| CN-113169060-A | Chamfer treatment agent composition and method for producing wafer | 中央硝子株式会社 | 2021-07-23 | — | — | CN | claimed |
| CN-107068540-A | The cleaning method of chip | 中央硝子株式会社 | 2017-08-18 | — | — | CN | claimed |
| US-9228120-B2 | Liquid chemical for forming protecting film | CENTRAL GLASS COMPANY, LIMITED (JP) | 2016-01-05 | — | — | US | claimed |
| US-8828144-B2 | Process for cleaning wafers | Central Grass Company, Limited (JP) | 2014-09-09 | — | — | US | claimed |
| CN-103283004-A | Wafer Cleaning Method | CENTRAL GLASS CO LTD | 2013-09-04 | — | — | CN | claimed |
| US-20120211025-A1 | PROCESS FOR CLEANING WAFERS | CENTRAL GLASS COMPANY, LIMITED (JP) | 2012-08-23 | — | — | US | claimed |
| US-20120164818-A1 | Process for Cleaning Wafers | CENTRAL GLASS COMPANY, LIMITED (JP) | 2012-06-28 | — | — | US | claimed |
| US-20120017934-A1 | Liquid Chemical for Forming Protecting Film | CENTRAL GLASS COMPANY, LIMITED (JP) | 2012-01-26 | — | — | US | claimed |
| US-20260018421-A1 | SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD | CENTRAL GLASS CO LTD (JP) | 2026-01-15 | — | — | US | disclosed |
| US-20250343040-A1 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD | CENTRAL GLASS CO LTD (JP) | 2025-11-06 | — | — | US | disclosed |
| US-6111126-A | Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond | DOW CORNING ASIA, LTD. (JP) | 2000-08-29 | — | — | US | disclosed |
| EP-1006118-A2 | Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond | Dow Corning Asia, Ltd. (JP) | 2000-06-07 | — | — | EP | disclosed |