SCHEMBL428565

SCHEMBL428565

CC(C)CO[Si](OCC(C)C)(OCC(C)C)C(C)C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25397012 0.86
SCHEMBL2961111 0.75 ALDH1A1 (0.33) ALDH1A1
SCHEMBL29655582 0.75 ALDH1A1 (0.33) ALDH1A1
SCHEMBL614697 0.75 ALDH1A1 (0.33) ALDH1A1
SCHEMBL2956052 0.75 ALDH1A1 (0.33) ALDH1A1
SCHEMBL431659 0.75
SCHEMBL200595 0.73 ALDH1A1 (0.36) ALDH1A1
SCHEMBL29655597 0.73 ALDH1A1 (0.32) ALDH1A1
SCHEMBL103898 0.71 LMNA (0.35)
SCHEMBL264609 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117069942-A Polysiloxane compound, composition for forming film, laminate, touch panel, and method for forming cured film 阪田油墨株式会社 2023-11-17 CN disclosed
CN-117075425-A Polysiloxane composition, composition for forming film, laminate, touch panel, and method for forming cured film 阪田油墨株式会社 2023-11-17 CN disclosed
CN-114430767-B Composition for forming film, laminate coated with the composition, touch panel using the laminate, and method for forming cured film 阪田油墨株式会社 2023-04-28 CN disclosed
CN-115145113-A Composition for forming coating, laminate coated with same, fingerprint authentication sensor using laminate, and method for forming cured coating 阪田油墨株式会社 2022-10-04 CN disclosed
CN-112955514-B Composition for forming coating film, glass substrate coated with the composition, and touch panel using the glass substrate 阪田油墨株式会社 2022-09-06 CN disclosed
CN-114430767-A Composition for forming coating, laminate coated with the composition, touch panel using the laminate, and method for forming cured coating 阪田油墨株式会社 2022-05-03 CN disclosed
CN-112955514-A Composition for forming coating film, glass substrate coated with the composition, and touch panel using the glass substrate 阪田油墨株式会社 2021-06-11 CN disclosed
US-8466229-B2 Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film HITACHI CHEMICAL CO., LTD. (JP) 2013-06-18 US disclosed
US-8362199-B2 Borazine-based resin, process for its production, borazine-based resin composition, insulating film and method for its formation HITACHI CHEMICAL CO., LTD. (JP) 2013-01-29 US disclosed
US-20120231575-A1 METHOD FOR PRODUCING SOLAR CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-09-13 US disclosed
EP-1672427-A1 RADIATION-CURING COMPOSITION, METHOD FOR STORING SAME, METHOD FOR FORMING CURED FILM, METHOD FOR FORMING PATTERN, METHOD FOR USING PATTERN, ELECTRONIC COMPONENT, AND OPTICAL WAVEGUIDE Hitachi Chemical Co., Ltd. (JP) 2006-06-21 EP disclosed
EP-1672426-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-06-21 EP disclosed
US-20060110610-A1 Borazine-based resin, and method for production thereof, borazine based resin composition, insulating coating and method for formation thereof, and electronic parts having the insulating coating NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2006-05-25 US disclosed
US-20060052566-A1 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts HITACHI CHEMICAL CO., LTD. (JP) 2006-03-09 US disclosed
US-20060047034-A1 Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film HITACHI CHEMICAL CO., LTD. (JP) 2006-03-02 US disclosed
US-20050266344-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
US-20050255326-A1 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts HITACHI CHEMICAL CO., LTD. (JP) 2005-11-17 US disclosed
US-20050239953-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-10-27 US disclosed
US-20050119394-A1 Comprising polysiloxane obtained by hydrolytic condensation; alcoholic solvent alcohol capable of dissolving siloxane resin, ammonium salt, and thermal decomposing/volatile compound; curing; bonding and high strength; mechanical properties HITACHI CHEMICAL CO., LTD. (JP) 2005-06-02 US disclosed
US-20040213911-A1 Method for forming porous film SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. (JP) 2004-10-28 US disclosed