Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 5/20 | 0.40 |
| ▸ | ERBB2 | P04626 | 1/20 | 0.40 |
| ▸ | FYN | P06241 | 1/20 | 0.40 |
| ▸ | MAOA | P21397 | 1/20 | 0.40 |
| ▸ | ACHE | P22303 | 1/20 | 0.40 |
| ▸ | AHR | P35869 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 6/20 | 0.34 |
| ▸ | HPGD | P15428 | 5/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.34 |
| ▸ | CYP1B1 | Q16678 | 2/20 | 0.34 |
| ▸ | THRB | P10828 | 1/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.33 |
| ▸ | GAA | P10253 | 2/20 | 0.33 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | CASP1 | P29466 | 1/20 | 0.32 |
| ▸ | CASP7 | P55210 | 1/20 | 0.32 |
| ▸ | CYP1A1 | P04798 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20561110 | 0.88 | CYP2A6 (0.37) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL312508 | 0.88 | CYP1A2 (0.48) | CYP1A2ERBB2FYNMAOAACHE | |
| Bromide SCHEMBL1470551 | 0.86 | CYP1A2 (0.47) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL201089 | 0.86 | CYP1A2 (0.47) | CYP1A2ERBB2FYNMAOAACHE | |
| Iodide SCHEMBL11375908 | 0.86 | CYP1A2 (0.47) | CYP1A2ERBB2FYNMAOAACHE | |
| Bromide SCHEMBL28027782 | 0.86 | CYP1A2 (0.47) | CYP1A2ERBB2FYNMAOAACHE | |
| Hydrochloric Acid SCHEMBL5318396 | 0.86 | CYP1A2 (0.47) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL18036614 | 0.79 | CYP1A2 (0.41) | CYP1A2ERBB2FYNMAOAACHE | |
| Bicarbonate SCHEMBL19435254 | 0.77 | ALDH1A1 (0.44) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL28678826 | 0.74 | CYP1A2 (0.40) | CYP1A2ERBB2FYNMAOAACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 175 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116874474-A | Bio-based degradable epoxy resin precursor, marine antifouling paint and preparation method thereof | 中国科学院宁波材料技术与工程研究所 | 2023-10-13 | — | — | CN | claimed |
| CN-112794991-B | Acrylic acid modified polythiol curing agent and preparation method thereof | 南宁珀源能源材料有限公司 | 2023-01-06 | — | — | CN | claimed |
| CN-111278883-B | Composition for curing resin, cured product of the composition, method for producing the composition and the cured product, and semiconductor device | JXTG能源株式会社 | 2022-12-30 | — | — | CN | claimed |
| CN-111278882-B | Composition for curing resin, cured product of the composition, method for producing the composition and the cured product, and semiconductor device | JXTG能源株式会社 | 2022-12-30 | — | — | CN | claimed |
| CN-111278884-B | Composition for curing resin, cured product of the composition, method for producing the composition and the cured product, and semiconductor device | JXTG能源株式会社 | 2022-12-30 | — | — | CN | claimed |
| CN-114793438-A | Resin composition | 索路思高新材料有限公司 | 2022-07-26 | — | — | CN | claimed |
| CN-111349414-A | Low-stress insulating glue and preparation method thereof | 上海得荣电子材料有限公司 | 2020-06-30 | — | — | CN | claimed |
| EP-3064521-B1 | LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-SEALED SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2018-07-11 | — | — | EP | claimed |
| US-9711378-B2 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-07-18 | — | — | US | claimed |
| US-20160314992-A1 | LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-SEALED SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-10-27 | — | — | US | claimed |
| EP-3064521-A1 | LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-SEALED SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2016-09-07 | — | — | EP | claimed |
| US-20260062548-A1 | RUBBER-BONDED CELLULOSE FIBERS AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION | KUREHA CORPORATION (JP) | 2026-03-05 | — | — | US | disclosed |
| EP-4582459-A1 | RUBBER-BONDED CELLULOSE FIBERS AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION | Kureha Corporation (JP) | 2025-07-09 | — | — | EP | disclosed |
| CN-119768439-A | Rubber-bonded cellulose fiber, method for producing same, resin composition, method for producing same, and cured resin composition | 株式会社吴羽 | 2025-04-04 | — | — | CN | disclosed |
| US-20250109222-A1 | CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-04-03 | — | — | US | disclosed |
| US-6399677-B2 | COMPRISING AN EPOXY RESIN, A CURING AGENT, AND AN INORGANIC FILLER IN THE FORM OF POROUS SILICA HAVING A SPECIFIC SURFACE AREA OF 6 TO 200 M2/G, A TRUE SPECIFIC GRAVITY OF 2.0 TO 2.2, AND A MEAN PARTICLE SIZE OF 2-50 MICRO M | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-06-04 | — | — | US | disclosed |
| US-6291556-B1 | FLAME RETARDANCE AND MOISTURE-PROOF RELIABILITY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-09-18 | — | — | US | disclosed |
| US-20010004651-A1 | Epoxy resin compositions and premolded semiconductor packages | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-06-21 | — | — | US | disclosed |
| EP-1049152-A2 | Semiconductor encapsulating epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-11-02 | — | — | EP | disclosed |
| EP-0953603-A2 | Flame retardant semiconductor encapsulating epoxy resin compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-11-03 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260062548-A1 | RUBBER-BONDED CELLULOSE FIBERS AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION | CROCC, WASF2, DCXR | CYP1A2 3796/4885ERBB2 4861/4885FYN 1584/4885 |
| US-20250109222-A1 | CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE | ZYX, MUS81, H1-0 | CYP1A2 4161/4885ERBB2 4514/4885FYN 3354/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.